Inventor · disambiguated record
A. Jay Stutzman
Also filed as: STUTZMAN A JAY
9 granted patents·35 citations·filing 2006–2008
86Inventor score
Top patents by PatentIndex Score
9 records- 0182US7514945B2Systems configured for utilizing semiconductor componentsMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 7, 2009·8 cites·6 claims
- 0278US7425839B2Systems and methods for testing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 16, 2008·8 cites·25 claims
- 0372US8011092B2Methods of providing semiconductor components within socketsMICRON TECHNOLOGY INC·Filed 2008·Granted Sep 6, 2011·4 cites·7 claims
- 0472US7439752B2Methods of providing semiconductor components within socketsMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 21, 2008·4 cites·9 claims
- 0569US7586319B2Methods of retaining semiconductor component configurations within socketsMICRON TECHNOLOGY INC·Filed 2008·Granted Sep 8, 2009·3 cites·7 claims
- 0659US8074353B2Methods of providing semiconductor components within socketsCRAM DANIEL P·Filed 2008·Granted Dec 13, 2011·2 cites·12 claims
- 0753US7857646B2Electrical testing apparatus having masked sockets and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 28, 2010·4 cites·12 claims
- 0850US8063646B2Apparatus and methods for testing microelectronic devicesCRAM DANIEL P·Filed 2006·Granted Nov 22, 2011·2 cites·22 claims
- 0946US7692437B2Systems and methods for testing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted Apr 6, 2010·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →