Inventor · disambiguated record
Aaron Cadag
Also filed as: CADAG AARON
17 granted patents·5 pending applications·51 citations·filing 2011–2025
90Inventor score
Top patents by PatentIndex Score
22 records- 0195US10079198B1QFN pre-molded leadframe having a solder wettable sidewall on each leadST MICROELECTRONICS INC·Filed 2017·Granted Sep 18, 2018·34 cites·16 claims
- 0289US11557548B2Package with interlocking leads and manufacturing the sameST MICROELECTRONICS INC·Filed 2020·Granted Jan 17, 2023·2 cites·20 claims
- 0388US9953933B1Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor dieST MICROELECTRONICS INC·Filed 2017·Granted Apr 24, 2018·7 cites·19 claims
- 0483US2025343119A1Bottom package exposed die mems pressure sensor integrated circuit package designST MICROELECTRONICS INC·Filed 2025·Application pending·0 cites
- 0582US10128169B1Package with backside protective layer during molding to prevent mold flashing failureST MICROELECTRONICS INC·Filed 2017·Granted Nov 13, 2018·3 cites·16 claims
- 0681US10903172B2Package with interlocking leads and manufacturing the sameST MICROELECTRONICS INC·Filed 2019·Granted Jan 26, 2021·2 cites·22 claims
- 0779US12255076B2Method for manufacturing leadless semiconductor package with wettable flanksST MICROELECTRONICS INC·Filed 2024·Granted Mar 18, 2025·0 cites·20 claims
- 0879US2025183135A1Lead stabilization in semiconductor packagesST MICROELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0979US2025183136A1Lead stabilization in semiconductor packagesST MICROELECTRONICS INC·Filed 2024·Application pending·0 cites
- 1078US11069601B2Leadless semiconductor package with wettable flanksST MICROELECTRONICS INC·Filed 2019·Granted Jul 20, 2021·2 cites·15 claims
- 1171US10529672B2Package with interlocking leads and manufacturing the sameST MICROELECTRONICS INC·Filed 2017·Granted Jan 7, 2020·1 cites·23 claims
- 1269US11929259B2Method for manufacturing leadless semiconductor package with wettable flanksST MICROELECTRONICS INC·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
- 1364US12211774B2Lead stabilization in semiconductor packagesST MICROELECTRONICS INC·Filed 2020·Granted Jan 28, 2025·0 cites·18 claims
- 1463US10910295B2QFN pre-molded leadframe having a solder wettable sidewall on each leadST MICROELECTRONICS INC·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
- 1558US11355423B2Bottom package exposed die MEMS pressure sensor integrated circuit package designST MICROELECTRONICS INC·Filed 2019·Granted Jun 7, 2022·0 cites·20 claims
- 1658US10541196B2QFN pre-molded leadframe having a solder wettable sidewall on each leadST MICROELECTRONICS INC·Filed 2018·Granted Jan 21, 2020·0 cites·19 claims
- 1752US10461019B2Package with backside protective layer during molding to prevent mold flashing failureST MICROELECTRONICS INC·Filed 2018·Granted Oct 29, 2019·0 cites·19 claims
- 1849US10483191B2Bottom package exposed die MEMS pressure sensor integrated circuit package designST MICROELECTRONICS INC·Filed 2016·Granted Nov 19, 2019·0 cites·18 claims
- 1947US11916090B2Tapeless leadframe package with exposed integrated circuit dieST MICROELECTRONICS INC·Filed 2021·Granted Feb 27, 2024·0 cites·7 claims
- 2045US2021391226A1Semiconductor device packages having cap with integrated electrical leadsST MICROELECTRONICS INC·Filed 2021·Application pending·0 cites
- 2136US9022773B2Compensating mold plunger for integrated circuit manufactureCADAG AARON·Filed 2011·Granted May 5, 2015·0 cites·27 claims
- 2236US2015179477A1Packaged ic devices and associated ic device packaging methodsST MICROELECTRONICS INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →