Inventor · disambiguated record
Aaditya Anand Candadai
Also filed as: CANDADAI AADITYA · CANDADAI AADITYA A · CANDADAI AADITYA ANAND
1 granted patent·9 pending applications·0 citations·filing 2022–2024
5Inventor score
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10 records- 0158US12374482B2Carrier chuck comprising a plurality of magnets and methods of forming and using thereofINTEL CORP·Filed 2022·Granted Jul 29, 2025·0 cites·4 claims
- 0255US2025130187A1Systems and methods for in-plane characterization of isotropic and anisotropic materialsPURDUE RESEARCH FOUNDATION·Filed 2024·Application pending·0 cites
- 0353US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 0451US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 0550US2025112140A1Stress mitigation architectures for glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0649US2024186197A1Substrate architecture for enhanced electrostatic chuckingINTEL CORP·Filed 2022·Application pending·0 cites
- 0748US2025206659A1Apparatus and system for coating of glass substrate having a plurality of through-holesINTEL CORP·Filed 2023·Application pending·0 cites
- 0844US2024113009A1Porous polymer dielectric layer on coreINTEL CORP·Filed 2022·Application pending·0 cites
- 0942US2024203664A1In core large area capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 1041US2024153857A1High aspect ratio tgv substrates through direct hybrid bonding of thin tgv substratesINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →