Inventor · disambiguated record
Aakrati Jain
Also filed as: JAIN AAKRATI
1 granted patent·11 pending applications·0 citations·filing 2022–2024
9Inventor score
Files withIBM12
Top patents by PatentIndex Score
12 records- 0157US12148699B2High aspect ratio buried power rail metallizationIBM·Filed 2022·Granted Nov 19, 2024·0 cites·15 claims
- 0256US2025379189A1Enhanced thermal solution for stacked cache die configurationIBM·Filed 2024·Application pending·0 cites
- 0354US2025087629A1Dicing Street Design for Hybrid BondingIBM·Filed 2023·Application pending·0 cites
- 0454US2025357237A1Electronic structure including die with backside power deliveryIBM·Filed 2024·Application pending·0 cites
- 0553US2025391781A1Dual-signature structure to verify authenticity in microelectronicsIBM·Filed 2024·Application pending·0 cites
- 0653US2025191937A1Redressing a chip site on a multi-chip laminate packageIBM·Filed 2023·Application pending·0 cites
- 0753US2025391772A1Integrated circuit resistive structure validation for authenticationIBM·Filed 2024·Application pending·0 cites
- 0852US2024203904A1Stress modulating pattern containing bonding dielectric layerIBM·Filed 2022·Application pending·0 cites
- 0951US2025140609A1Negative-tone organic dielectric with fine metal pillar resolutionIBM·Filed 2023·Application pending·0 cites
- 1049US2025004208A1Photonic optical fiber packagingIBM·Filed 2023·Application pending·0 cites
- 1147US2025391786A1Piezoelectric-based authentication for counterfeit prevention in microelectronicsIBM·Filed 2024·Application pending·0 cites
- 1247US2024321593A1Dielectric bridge for high bandwidth inter-die communicationIBM·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →