Inventor · disambiguated record
Aaron Scott Lukas
Also filed as: LUKAS AARON S · LUKAS AARON SCOTT
18 granted patents·3 pending applications·1,558 citations·filing 2002–2014
95Inventor score
Top patents by PatentIndex Score
21 records- 0199US6846515B2Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constantsAIR PROD & CHEM·Filed 2002·Granted Jan 25, 2005·667 cites·99 claims
- 0298US7098149B2Mechanical enhancement of dense and porous organosilicate materials by UV exposureAIR PROD & CHEM·Filed 2003·Granted Aug 29, 2006·624 cites·31 claims
- 0397US7332445B2Porous low dielectric constant compositions and methods for making and using sameAIR PROD & CHEM·Filed 2005·Granted Feb 19, 2008·65 cites·55 claims
- 0490US7581549B2Method for removing carbon-containing residues from a substrateAIR PROD & CHEM·Filed 2005·Granted Sep 1, 2009·18 cites·20 claims
- 0590US7404990B2Non-thermal process for forming porous low dielectric constant filmsAIR PROD & CHEM·Filed 2002·Granted Jul 29, 2008·47 cites·33 claims
- 0689US8399349B2Materials and methods of forming controlled voidVRTIS RAYMOND NICHOLAS·Filed 2007·Granted Mar 19, 2013·13 cites·13 claims
- 0788US7468290B2Mechanical enhancement of dense and porous organosilicate materials by UV exposureAIR PROD & CHEM·Filed 2003·Granted Dec 23, 2008·33 cites·20 claims
- 0887US7932188B2Mechanical enhancement of dense and porous organosilicate materials by UV exposureAIR PROD & CHEM·Filed 2008·Granted Apr 26, 2011·9 cites·19 claims
- 0985US7384471B2Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constantsAIR PROD & CHEM·Filed 2003·Granted Jun 10, 2008·28 cites·35 claims
- 1084US7943195B2Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constantsAIR PROD & CHEM·Filed 2008·Granted May 17, 2011·8 cites·20 claims
- 1183US8293001B2Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constantsVRTIS RAYMOND NICHOLAS·Filed 2011·Granted Oct 23, 2012·6 cites·4 claims
- 1282US9061317B2Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constantsVRTIS RAYMOND NICHOLAS·Filed 2012·Granted Jun 23, 2015·8 cites·20 claims
- 1380US8951342B2Methods for using porogens for low k porous organosilica glass filmsVRTIS RAYMOND NICHOLAS·Filed 2011·Granted Feb 10, 2015·5 cites·23 claims
- 1473US7470454B2Non-thermal process for forming porous low dielectric constant filmsAIR PROD & CHEM·Filed 2003·Granted Dec 30, 2008·14 cites·40 claims
- 1566US8846522B2Materials and methods of forming controlled voidAIR PROD & CHEM·Filed 2013·Granted Sep 30, 2014·1 cites·7 claims
- 1661US7074489B2Low dielectric constant material and method of processing by CVDAIR PROD & CHEM·Filed 2002·Granted Jul 11, 2006·7 cites·31 claims
- 1759US9293361B2Materials and methods of forming controlled voidAIR PROD & CHEM·Filed 2014·Granted Mar 22, 2016·0 cites·20 claims
- 1850US8137764B2Mechanical enhancer additives for low dielectric filmsVINCENT JEAN LOUISE·Filed 2004·Granted Mar 20, 2012·5 cites·36 claims
- 1948US2006196525A1Method for removing a residue from a chamberVRTIS RAYMOND N·Filed 2005·Application pending·0 cites
- 2043US2008268177A1Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric ConstantsAIR PROD & CHEM·Filed 2008·Application pending·0 cites
- 2138US2004197474A1Method for enhancing deposition rate of chemical vapor deposition filmsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →