Inventor · disambiguated record
Aastha Uppal
Also filed as: UPPAL AASTHA
12 granted patents·6 pending applications·15 citations·filing 2017–2023
84Inventor score
Files withINTEL CORP18
Top patents by PatentIndex Score
18 records- 0191US11721607B2Integrated circuit assemblies having metal foam structuresINTEL CORP·Filed 2020·Granted Aug 8, 2023·3 cites·20 claims
- 0288US11387175B2Interposer package-on-package (PoP) with solder array thermal contactsINTEL CORP·Filed 2018·Granted Jul 12, 2022·6 cites·16 claims
- 0381US11676883B2Thermoelectric coolers combined with phase-change material in integrated circuit packagesINTEL CORP·Filed 2019·Granted Jun 13, 2023·2 cites·23 claims
- 0480US11574851B2Coupled cooling fins in ultra-small systemsINTEL CORP·Filed 2019·Granted Feb 7, 2023·3 cites·23 claims
- 0569US11735495B2Active package cooling structures using molded substrate packaging technologyINTEL CORP·Filed 2019·Granted Aug 22, 2023·1 cites·14 claims
- 0654US12021016B2Thermally enhanced silicon back end layers for improved thermal performanceINTEL CORP·Filed 2020·Granted Jun 25, 2024·0 cites·16 claims
- 0751US10600699B2Apparatus for inspection of a package assembly with a thermal solutionINTEL CORP·Filed 2017·Granted Mar 24, 2020·0 cites·17 claims
- 0850US12048123B2Heat dissipation device having shielding/containment extensionsINTEL CORP·Filed 2020·Granted Jul 23, 2024·0 cites·18 claims
- 0949US2025112106A1Flexible thermal interposer for backside cooling of double-sided packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1047US11545407B2Thermal management solutions for integrated circuit packagesINTEL CORP·Filed 2019·Granted Jan 3, 2023·0 cites·20 claims
- 1146US11830783B2Embedded substrate heat sink for bottom side coolingINTEL CORP·Filed 2019·Granted Nov 28, 2023·0 cites·26 claims
- 1245US2021249326A1Heat dissipation devices having thermal interface material containment structuresINTEL CORP·Filed 2020·Application pending·0 cites
- 1344US11769753B2Thermally-optimized tunable stack in cavity package-on-packageINTEL CORP·Filed 2018·Granted Sep 26, 2023·0 cites·11 claims
- 1443US2021259134A1Substrate cooling using heat pipe vapor chamber stiffener and ihs legsINTEL CORP·Filed 2020·Application pending·0 cites
- 1540US11664294B2Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assembliesINTEL CORP·Filed 2019·Granted May 30, 2023·0 cites·18 claims
- 1640US2020273811A1Ic die package thermal spreader and emi shield comprising graphiteINTEL CORP·Filed 2019·Application pending·0 cites
- 1740US2020273768A1Crystalline carbon heat spreading materials for ic die hot spot reductionINTEL CORP·Filed 2019·Application pending·0 cites
- 1838US2020219789A1Thermal management solutions for integrated circuit assemblies using phase change materialsINTEL CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →