Inventor · disambiguated record
Abelardo Jr. Hadap Advincula
Also filed as: ADVINCULA ABELARDO JR · ADVINCULA ABELARDO JR HADAP
6 granted patents·1 pending application·20 citations·filing 2007–2009
77Inventor score
Top patents by PatentIndex Score
7 records- 0171US7785929B2Mountable integrated circuit package system with exposed external interconnectsSTATS CHIPPAC LTD·Filed 2008·Granted Aug 31, 2010·5 cites·20 claims
- 0269US8115287B2Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2009·Granted Feb 14, 2012·5 cites·20 claims
- 0368US8067825B2Integrated circuit package system with multiple dieADVINCULA ABELARDO JR HADAP·Filed 2007·Granted Nov 29, 2011·6 cites·20 claims
- 0466US8258614B2Integrated circuit package system with package integrationCAMACHO ZIGMUND RAMIREZ·Filed 2007·Granted Sep 4, 2012·3 cites·20 claims
- 0560US9059074B2Integrated circuit package system with planar interconnectCAMACHO ZIGMUND RAMIREZ·Filed 2008·Granted Jun 16, 2015·1 cites·20 claims
- 0645US8957515B2Integrated circuit package system with array of external interconnectsCAMACHO ZIGMUND RAMIREZ·Filed 2007·Granted Feb 17, 2015·0 cites·10 claims
- 0745US2009243069A1Integrated circuit package system with redistributionCAMACHO ZIGMUND RAMIREZ·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →