Inventor · disambiguated record
Abhinandan Dixit
Also filed as: DIXIT ABHINANDAN · DIXIT ABHINANDAN HEMANT
0 granted patents·9 pending applications·0 citations·filing 2022–2023
Top patents by PatentIndex Score
9 records- 0158US2023019052A1Fabrication of embedded die packaging comprising laser drilled viasGAN SYSTEMS INC·Filed 2022·Application pending·0 cites
- 0258US2025140665A1Leaded package using routing layer for integrated circuit dieINFINEON TECH CANADA INC·Filed 2023·Application pending·0 cites
- 0356US2024213125A1Edge-structured leadframe for embedded die packaging of power semiconductor devicesGAN SYSTEMS INC·Filed 2022·Application pending·0 cites
- 0454US2025140674A1Multi-die packageINFINEON TECH CANADA INC·Filed 2023·Application pending·0 cites
- 0553US2023402342A1Dual-side cooled embedded die packaging for power semiconductor devicesGAN SYSTEMS INC·Filed 2023·Application pending·0 cites
- 0650US2024213127A1Embedded die packaging for power semiconductor devices for improved solder reliabilityGAN SYSTEMS INC·Filed 2023·Application pending·0 cites
- 0750US2024421196A1GaN SEMICONDUCTOR POWER TRANSISTOR WITH SLANTED GATE FIELD PLATE AND METHOD OF FABRICATIONGAN SYSTEMS INC·Filed 2023·Application pending·0 cites
- 0847US2025133762A1Substrate biasing for a transistor structure that uses a two-dimensional electron gasINFINEON TECH CANADA INC·Filed 2023·Application pending·0 cites
- 0940US2025133837A1Monolithic structure for substrate biasing for a transistor that uses a two-dimensional electron gasINFINEON TECH CANADA INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →