Inventor · disambiguated record
Abdolreza Langari
Also filed as: LANGARI ABDOLREZA
9 granted patents·2 pending applications·99 citations·filing 1998–2023
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0194US11670614B2Integrated circuit assembly with hybrid bondingQUALCOMM INC·Filed 2020·Granted Jun 6, 2023·3 cites·20 claims
- 0279US6261871B1Method and structure for temperature stabilization in flip chip technologyCONEXANT SYSTEMS INC·Filed 2000·Granted Jul 17, 2001·30 cites·12 claims
- 0373US12300655B2Integrated circuit assembly with hybrid bondingQUALCOMM INC·Filed 2023·Granted May 13, 2025·0 cites·22 claims
- 0467US6848500B1Cooling system for pulsed power electronicsSKYWORKS SOLUTIONS INC·Filed 1999·Granted Feb 1, 2005·37 cites·14 claims
- 0563US6359343B1Temperature stabilization in flip chip technologyCONEXANT SYSTEMS INC·Filed 2001·Granted Mar 19, 2002·11 cites·21 claims
- 0657US11437307B2Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second directionQUALCOMM INC·Filed 2020·Granted Sep 6, 2022·0 cites·14 claims
- 0752US10916494B2Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second directionQUALCOMM INC·Filed 2019·Granted Feb 9, 2021·0 cites·12 claims
- 0848US2023036650A1Sense lines for high-speed application packagesQUALCOMM INC·Filed 2021·Application pending·0 cites
- 0945US2021210452A1Integrated passive device (ipd) coupled to front side of integrated deviceQUALCOMM INC·Filed 2020·Application pending·0 cites
- 1044US6586847B1Method and structure for temperature stabilization in semiconductor devicesSKYWORKS SOLUTIONS INC·Filed 2000·Granted Jul 1, 2003·2 cites·7 claims
- 1143US6134110ACooling system for power amplifier and communication system employing the sameCONEXNANT SYSTEMS INC·Filed 1998·Granted Oct 17, 2000·16 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →