Inventor · disambiguated record
Abhay Watwe
Also filed as: WATWE ABHAY · WATWE ABHAY A
9 granted patents·2 pending applications·293 citations·filing 2000–2006
91Inventor score
Top patents by PatentIndex Score
11 records- 0194US6653730B2Electronic assembly with high capacity thermal interfaceINTEL CORP·Filed 2000·Granted Nov 25, 2003·83 cites·55 claims
- 0292US6661660B2Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachmentINTEL CORP·Filed 2001·Granted Dec 9, 2003·72 cites·17 claims
- 0391US6639799B2Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachmentINTEL CORP·Filed 2000·Granted Oct 28, 2003·67 cites·8 claims
- 0482US7170098B2Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heatINTEL CORP·Filed 2005·Granted Jan 30, 2007·8 cites·6 claims
- 0580US6770966B2Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heatINTEL CORP·Filed 2001·Granted Aug 3, 2004·21 cites·10 claims
- 0676US6504721B1Thermal cooling apparatusINTEL CORP·Filed 2000·Granted Jan 7, 2003·25 cites·27 claims
- 0764US6921706B2Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heatINTEL CORP·Filed 2004·Granted Jul 26, 2005·8 cites·6 claims
- 0863US7098079B2Electronic assembly with high capacity thermal interface and methods of manufactureINTEL CORP·Filed 2003·Granted Aug 29, 2006·8 cites·27 claims
- 0961US7432532B2Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heatINTEL CORP·Filed 2006·Granted Oct 7, 2008·1 cites·4 claims
- 1044US2006127672A1Method of providing a heat spreaderCHRYSLER GREGORY M·Filed 2006·Application pending·0 cites
- 1139US2003152773A1Diamond integrated heat spreader and method of manufacturing sameFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →