Inventor · disambiguated record
Adam M. Kennedy
Also filed as: KENNEDY ADAM M
37 granted patents·5 pending applications·426 citations·filing 1991–2025
97Inventor score
Top patents by PatentIndex Score
42 records- 0193US5701008AIntegrated infrared microlens and gas molecule getter grating in a vacuum packageHUGHES AIRCRAFT CO·Filed 1996·Granted Dec 23, 1997·153 cites·20 claims
- 0291US9570321B1Use of an external getter to reduce package pressureRAYTHEON CO·Filed 2015·Granted Feb 14, 2017·6 cites·20 claims
- 0384US10451487B1Per-pixel dark reference bolometerRAYTHEON CO·Filed 2018·Granted Oct 22, 2019·5 cites·18 claims
- 0483US8928883B1Optical device for detection of an agentJAWORSKI FRANK B·Filed 2010·Granted Jan 6, 2015·5 cites·21 claims
- 0582US9093444B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2013·Granted Jul 28, 2015·4 cites·6 claims
- 0682US5921461AVacuum package having vacuum-deposited local getter and its preparationRAYTHEON CO·Filed 1997·Granted Jul 13, 1999·87 cites·15 claims
- 0778US9427776B2Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arraysRAYTHEON CO·Filed 2012·Granted Aug 30, 2016·1 cites·11 claims
- 0877US6417514B1Sensor/support system having a stabilization structure affixed to a side of a platform oppositely disposed from a sensor assemblyRAYTHEON CO·Filed 2000·Granted Jul 9, 2002·30 cites·20 claims
- 0975US9969610B2Wafer level MEMS package including dual seal ringRAYTHEON CO·Filed 2017·Granted May 15, 2018·1 cites·12 claims
- 1073US9334154B2Hermetically sealed package having stress reducing layerRAYTHEON CO·Filed 2014·Granted May 10, 2016·2 cites·22 claims
- 1171US7105821B1Thermally stabilized radiation detector utilizing temperature controlled radiation filterRAYTHEON CO·Filed 2003·Granted Sep 12, 2006·20 cites·22 claims
- 1270US9227839B2Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave couplingRAYTHEON CO·Filed 2014·Granted Jan 5, 2016·2 cites·14 claims
- 1370US5173336AMetal organic chemical vapor deposition (MOCVD) reactor with recirculation suppressing flow guideSANTA BARBARA RES CENTER·Filed 1991·Granted Dec 22, 1992·30 cites·6 claims
- 1465US8389947B2Method and system for detecting neutron radiationKENNEDY ADAM M·Filed 2011·Granted Mar 5, 2013·3 cites·22 claims
- 1564US12261186B2Mosaic focal plane arrayRAYTHEON CO·Filed 2021·Granted Mar 25, 2025·0 cites·21 claims
- 1664US6649913B1Method and apparatus providing focal plane array active thermal control elementsRAYTHEON CO·Filed 2002·Granted Nov 18, 2003·12 cites·19 claims
- 1763US7084010B1Integrated package design and method for a radiation sensing deviceRAYTHEON CO·Filed 2003·Granted Aug 1, 2006·13 cites·12 claims
- 1863US2025151444A1Mosaic focal plane arrayRAYTHEON CO·Filed 2025·Application pending·0 cites
- 1962US6077046AGetter assembly having porous metallic support and its use in a vacuum apparatusRAYTHEON CO·Filed 1998·Granted Jun 20, 2000·21 cites·22 claims
- 2060US8653467B2Multichip packaging for imaging systemBLACK STEPHEN H·Filed 2012·Granted Feb 18, 2014·1 cites·20 claims
- 2159US10262913B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2018·Granted Apr 16, 2019·0 cites·8 claims
- 2258US9174836B2Integrated bondline spacers for wafer level packaged circuit devicesRAYTHEON CO·Filed 2014·Granted Nov 3, 2015·0 cites·23 claims
- 2357US9187312B2Integrated bondline spacers for wafer level packaged circuit devicesRAYTHEON CO·Filed 2014·Granted Nov 17, 2015·0 cites·15 claims
- 2456US10315918B2Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arraysRAYTHEON CO·Filed 2016·Granted Jun 11, 2019·0 cites·18 claims
- 2556US9966320B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2016·Granted May 8, 2018·0 cites·5 claims
- 2656US9196556B2Getter structure and method for forming such structureRAYTHEON CO·Filed 2014·Granted Nov 24, 2015·0 cites·6 claims
- 2754US9865519B2Use of an external getter to reduce package pressureRAYTHEON CO·Filed 2017·Granted Jan 9, 2018·0 cites·20 claims
- 2853US10267997B2Infrared scene projector with per-pixel spectral and polarisation capabilityRAYTHEON CO·Filed 2015·Granted Apr 23, 2019·0 cites·16 claims
- 2953US9520332B2Wafer level package solder barrier used as vacuum getterRAYTHEON CO·Filed 2015·Granted Dec 13, 2016·0 cites·4 claims
- 3052US9708181B2Hermetically sealed package having stress reducing layerRAYTHEON CO·Filed 2016·Granted Jul 18, 2017·0 cites·4 claims
- 3152US9091748B2Methods and apparatus for 3D UV imagingKENNEDY ADAM M·Filed 2012·Granted Jul 28, 2015·1 cites·26 claims
- 3252US8218220B1Variable aperture optical device having a microshutterDODDS ROBERT K·Filed 2009·Granted Jul 10, 2012·2 cites·39 claims
- 3350US9771258B2Wafer level MEMS package including dual seal ringRAYTHEON CO·Filed 2015·Granted Sep 26, 2017·0 cites·4 claims
- 3449US6326611B1Integrated multiple sensor packageRAYTHEON CO·Filed 1999·Granted Dec 4, 2001·14 cites·34 claims
- 3546US9105800B2Method of forming deposited patterns on a surfaceRAYTHEON CO·Filed 2013·Granted Aug 11, 2015·0 cites·3 claims
- 3646US2016040282A1Getter structure and method for forming such structureRAYTHEON CO·Filed 2015·Application pending·0 cites
- 3744US11750945B2Imager with integrated asynchronous laser pulse detection having a signal component along a second electrical pathway passes through an ALPD readout integrated circuit to an imaging readout integrated circuitRAYTHEON CO·Filed 2020·Granted Sep 5, 2023·0 cites·12 claims
- 3842US2014175590A1Getter structure for wafer level vacuum packaged deviceRAYTHEON CO·Filed 2012·Application pending·0 cites
- 3941US2013334635A1Pixel structure with reduced vacuum requirementsRAYTHEON CO·Filed 2012·Application pending·0 cites
- 4039US11284025B2Digital pixel having high sensitivity and dynamic rangeRAYTHEON CO·Filed 2020·Granted Mar 22, 2022·0 cites·18 claims
- 4139US6107216ABonded structure with high-conductivity bonding elementRAYTHEON CO·Filed 1997·Granted Aug 22, 2000·13 cites·15 claims
- 4234US2012281113A1USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATIONS TO YIELD A LOW COST, SMALL SIZE CAMERA ON A CHIPKENNEDY ADAM M·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →