Inventor · disambiguated record
Adolf E. Wirsing
Also filed as: WIRSING ADOLF E · WIRSING ADOLF ERNEST
9 granted patents·2 pending applications·529 citations·filing 1989–2007
91Inventor score
Top patents by PatentIndex Score
11 records- 0194US5130779ASolder mass having conductive encapsulating arrangementIBM·Filed 1990·Granted Jul 14, 1992·185 cites·47 claims
- 0292US5251806AMethod of forming dual height solder interconnectionsIBM·Filed 1992·Granted Oct 12, 1993·144 cites·48 claims
- 0387US5104695AMethod and apparatus for vapor deposition of material onto a substrateIBM·Filed 1989·Granted Apr 14, 1992·54 cites·16 claims
- 0480US6706621B2Wafer integrated rigid support ringIBM·Filed 2002·Granted Mar 16, 2004·29 cites·12 claims
- 0580US5457345AMetallization composite having nickle intermediate/interfaceIBM·Filed 1994·Granted Oct 10, 1995·56 cites·11 claims
- 0678US5719070AMetallization composite having nickel intermediate/interfaceIBM·Filed 1996·Granted Feb 17, 1998·49 cites·20 claims
- 0777US7288492B2Method for forming interconnects on thin wafersIBM·Filed 2005·Granted Oct 30, 2007·7 cites·7 claims
- 0846US7138326B2Wafer integrated rigid support ringIBM·Filed 2003·Granted Nov 21, 2006·3 cites·7 claims
- 0946US2007278729A1Method for forming interconnects on thin wafersGARDECKI LEONARD J·Filed 2007·Application pending·0 cites
- 1045US6951775B2Method for forming interconnects on thin wafersIBM·Filed 2003·Granted Oct 4, 2005·2 cites·13 claims
- 1145US2007045830A1Wafer integrated rigid support ringIBM·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →