Inventor · disambiguated record
Adam Young
Also filed as: YOUNG ADAM · YOUNG ADAM C · YOUNG ADAM CHRISTOPHER
6 granted patents·5 pending applications·35 citations·filing 2010–2024
77Inventor score
Top patents by PatentIndex Score
11 records- 0188US11838336B2Virtual events-based social networkVARTY INC·Filed 2021·Granted Dec 5, 2023·4 cites·20 claims
- 0288US9058607B2Using network security information to detection transaction fraudGANTI VISWESWARARAO·Filed 2010·Granted Jun 16, 2015·24 cites·20 claims
- 0379US9231956B1Utilizing entity-generic records for determining access to assetsEMC CORP·Filed 2013·Granted Jan 5, 2016·6 cites·20 claims
- 0470US12466555B2Apparatus and method for mounting a payload to a flight systemTRITON SYSTEMS INC·Filed 2024·Granted Nov 11, 2025·0 cites·25 claims
- 0557US2023252497A1Systems and methods for measuring impact of online search queries on user actionsFMR LLC·Filed 2022·Application pending·0 cites
- 0656US10892832B2Moving platform roll angle determination system using RF communications linkTELEDYNE SCIENT & IMAGING LLC·Filed 2014·Granted Jan 12, 2021·1 cites·34 claims
- 0750US2013185110A1System for completing community service hours onlineYOUNG ADAM C·Filed 2013·Application pending·0 cites
- 0846US2012330857A1Online Community ServiceYOUNG ADAM CHRISTOPHER·Filed 2011·Application pending·0 cites
- 0944US2025377235A1Methods and Systems for Measuring and Deploying Mass transported by a Railway VehicleINTRAMOTEV INC·Filed 2024·Application pending·0 cites
- 1043US2012158586A1Aggregating transaction information to detect fraudGANTI VISWESWARARAO·Filed 2010·Application pending·0 cites
- 1140US10699954B2Through-substrate vias formed by bottom-up electroplatingTELEDYNE SCIENT & IMAGING LLC·Filed 2018·Granted Jun 30, 2020·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →