Inventor · disambiguated record
Aenee Jang
Also filed as: JANG AENEE
10 granted patents·9 pending applications·8 citations·filing 2019–2025
82Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD19
Top patents by PatentIndex Score
19 records- 0191US11862613B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 2, 2024·2 cites·20 claims
- 0286US12347819B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·1 cites·20 claims
- 0385US12237290B2Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 25, 2025·2 cites·20 claims
- 0485US11581234B2Semiconductor package with improved heat dissipationSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·2 cites·19 claims
- 0580US11581248B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·1 cites·20 claims
- 0676US2025096088A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0773US12191238B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 0870US2025286036A1Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0966US12341074B2Semiconductor package with increased thermal dissipationSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·19 claims
- 1065US11810898B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 7, 2023·0 cites·20 claims
- 1162US2025167156A1Semiconductor packages and methods of manufacturing the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1260US11594516B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·19 claims
- 1359US11600601B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 1454US2024234373A9Memory device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1553US2024153898A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1653US2025096218A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1752US2025069972A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1849US2023086202A1Semiconductor chip and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1941US2020402883A1Semiconductor packages having heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →