Inventor · disambiguated record
Afshin Dadvand
Also filed as: DADVAND AFSHIN
2 granted patents·17 pending applications·0 citations·filing 2016–2025
24Inventor score
Top patents by PatentIndex Score
19 records- 0154US2025323130A1Wafer-Level Bond-Line ControlWOLFSPEED INC·Filed 2025·Application pending·0 cites
- 0252US11545633B23,7-bis(2-oxoindolin-3-ylidene)benzo[1,2-b:4,5-b′]difuran-2,6-dione dicyanide-based materials and uses thereof in organic electronic devicesNAT RES COUNCIL CANADA·Filed 2019·Granted Jan 3, 2023·0 cites·14 claims
- 0352US2025122413A1Multifunctional Adhesion Promoter for Semiconductor Device PackagesWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 0452US2025105196A1Semiconductor Die BondingWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 0552US2025038056A1Submounts with Stud Protrusions for Semiconductor PackagesWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 0652US2025125231A1Direct Bonded Semiconductor Die PackageWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 0748US2025038055A1Submounts with Stud Protrusions for Semiconductor PackagesWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 0848US2024421044A1Die-Attach Fillet Height ReductionWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 0947US2024355738A1Power Semiconductor Devices Including Beryllium MetallizationWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1046US2024258217A1Semiconductor device packages including multilayer stacks with improved adhesionWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1146US2024274514A1Electroless Die-Attach Process for Semiconductor PackagingWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1245US2024182757A1Core-Shell Particle Die-Attach MaterialWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 1345US2025273536A1Integrated Active Cooling in Power PackagesWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1445US2025266350A1Layered Metallization in Power Semiconductor PackagesWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1544US2025226338A1Power Semiconductor Devices Including Shape-Memory MetallizationWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1644US2025316486A1Method of Uniform NiSi DepositionWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1742US10125285B2Method of printing ultranarrow-gap linesNAT RES COUNCIL CANADA·Filed 2016·Granted Nov 13, 2018·0 cites·16 claims
- 1840US2024321663A1High-performance stress buffer die-coat and devices and processes implementing the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1940US2024321659A1Die-coat material configured to enhance device reliability and devices and processes implementing the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →