Inventor · disambiguated record
Agnes Baffert
Also filed as: BAFFERT AGNES
1 granted patent·3 pending applications·1 citations·filing 2016–2021
17Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0175US11437527B2Encapsulation cover for an electronic package and fabrication processST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Sep 6, 2022·1 cites·17 claims
- 0260US2022029034A1Encapsulation cover for an electronic package and fabrication processST MICROELECTRONICS GRENOBLE 2·Filed 2021·Application pending·0 cites
- 0348US2019157469A1Encapsulation cover for an electronic package and fabrication processST MICROELECTRONICS GRENOBLE 2·Filed 2018·Application pending·0 cites
- 0428US2017127567A1Electronic device equipped with a heat sinkSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →