Inventor · disambiguated record
Agatino Minotti
Also filed as: MINOTTI AGATINO · MINOTTI AGATINO CARMELO
24 granted patents·7 pending applications·43 citations·filing 2005–2025
93Inventor score
Files withST MICROELECTRONICS SRL24MINOTTI AGATINO3LO PRESTI MATTEO1MINOTTI AGATINO CARMELO1PATTI DAVIDE GIUSEPPE1
Top patents by PatentIndex Score
31 records- 0194US12278174B2Power semiconductor device with a double island surface mount packageST MICROELECTRONICS SRL·Filed 2023·Granted Apr 15, 2025·1 cites·20 claims
- 0290US9986631B2Electronic power module with enhanced thermal dissipation and manufacturing method thereofST MICROELECTRONICS SRL·Filed 2016·Granted May 29, 2018·16 cites·20 claims
- 0382US2025391761A1Power semiconductor device with a double island surface mount packageST MICROELECTRONICS SRL·Filed 2025·Application pending·0 cites
- 0480US9570380B2Electronic device provided with an encapsulation structure with improved electric accessibility and method of manufacturing the electronic deviceST MICROELECTRONICS SRL·Filed 2015·Granted Feb 14, 2017·4 cites·15 claims
- 0578US10615142B2Microelectronic device having protected connections and manufacturing process thereofST MICROELECTRONICS SRL·Filed 2018·Granted Apr 7, 2020·1 cites·25 claims
- 0676US7824958B2Process and system for manufacturing an encapsulated semiconductor deviceST MICROELECTRONICS SRL·Filed 2008·Granted Nov 2, 2010·4 cites·19 claims
- 0772US9107331B2Intelligent power module and related assembling methodLO PRESTI MATTEO·Filed 2012·Granted Aug 11, 2015·6 cites·26 claims
- 0871US11658108B2Power semiconductor device with a double island surface mount packageST MICROELECTRONICS SRL·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 0971US9786626B2Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereofST MICROELECTRONICS SRL·Filed 2015·Granted Oct 10, 2017·2 cites·21 claims
- 1069US7372142B2Vertical conduction power electronic device package and corresponding assembling methodST MICROELECTRONICS SRL·Filed 2005·Granted May 13, 2008·5 cites·20 claims
- 1166US2024429132A1Blocking element for connecting pins of semiconductor diceST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 1265US9786516B2Power device having reduced thicknessST MICROELECTRONICS SRL·Filed 2015·Granted Oct 10, 2017·1 cites·12 claims
- 1364US2025087623A1Packaged semiconductor device having improved reliability and inspectionability and manufacturing method thereofST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 1463US10985131B2Microelectronic device having protected connections and manufacturing process thereofST MICROELECTRONICS SRL·Filed 2020·Granted Apr 20, 2021·0 cites·21 claims
- 1561US12374648B2Connecting strip for discrete and power electronic devicesST MICROELECTRONICS SRL·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1661US10910302B2Power semiconductor device with a double island surface mount packageST MICROELECTRONICS SRL·Filed 2019·Granted Feb 2, 2021·0 cites·21 claims
- 1761US8519546B2Stacked multi-die electronic device with interposed electrically conductive strapPATTI DAVIDE GIUSEPPE·Filed 2012·Granted Aug 27, 2013·1 cites·20 claims
- 1860US12094806B2Blocking element for connecting pins of semiconductor diceST MICROELECTRONICS SRL·Filed 2021·Granted Sep 17, 2024·0 cites·18 claims
- 1959US2025323205A1Connecting strip for discrete and power electronic devicesST MICROELECTRONICS SRL·Filed 2025·Application pending·0 cites
- 2058US9099432B2Electronic device for power applicationsMINOTTI AGATINO·Filed 2012·Granted Aug 4, 2015·1 cites·15 claims
- 2156US2023317685A1Packaged electronic device comprising a plurality of power transistorsST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 2251US12183707B2Packaged semiconductor device having improved reliability and inspectionability and manufacturing method thereofST MICROELECTRONICS SRL·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 2351US8513811B2Electronic device and method for connecting a die to a connection terminalMINOTTI AGATINO·Filed 2011·Granted Aug 20, 2013·1 cites·28 claims
- 2449US10490523B2Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereofST MICROELECTRONICS SRL·Filed 2017·Granted Nov 26, 2019·0 cites·20 claims
- 2548US9275943B2Power device having reduced thicknessSTELLA CRISTIANO GIANLUCA·Filed 2012·Granted Mar 1, 2016·0 cites·16 claims
- 2645US8410593B2Process and system for manufacturing an encapsulated semiconductor deviceMINOTTI AGATINO·Filed 2010·Granted Apr 2, 2013·0 cites·20 claims
- 2742US9362142B2Flip-chip electronic device and production method thereofST MICROELECTRONICS SRL·Filed 2013·Granted Jun 7, 2016·0 cites·16 claims
- 2838US2011260314A1Die package and corresponding method for realizing a double side cooling of a die packageST MICROELECTRONICS SRL·Filed 2011·Application pending·0 cites
- 2931US2016099200A1Aluminum alloy lead frame for a semiconductor device and corresponding manufacturing processST MICROELECTRONICS SRL·Filed 2015·Application pending·0 cites
- 3029US10720561B2Thermoelectric energy harvesting device and method of harvesting environmental energyST MICROELECTRONICS SRL·Filed 2015·Granted Jul 21, 2020·0 cites·14 claims
- 3127US8471370B2Semiconductor element with semiconductor die and lead framesMINOTTI AGATINO CARMELO·Filed 2011·Granted Jun 25, 2013·0 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →