Inventor · disambiguated record
Ahmad Al Mohammad
Also filed as: AL MOHAMMAD AHMAD
4 granted patents·2 citations·filing 2020–2023
59Inventor score
Technology areasH10W
Files withINTEL CORP4
Top patents by PatentIndex Score
4 records- 0187US11935808B2IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted Mar 19, 2024·2 cites·22 claims
- 0276US12283535B2IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnectsINTEL CORP·Filed 2023·Granted Apr 22, 2025·0 cites·14 claims
- 0354US11984377B2IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted May 14, 2024·0 cites·25 claims
- 0450US11923267B2IC die with solderable thermal interface structures for assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted Mar 5, 2024·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →