Inventor · disambiguated record
Ah Lek Hu
Also filed as: HU AH LEK
9 granted patents·436 citations·filing 2000–2005
90Inventor score
Files withNAT SEMICONDUCTOR CORP9
Top patents by PatentIndex Score
9 records- 0195US6872599B1Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)NAT SEMICONDUCTOR CORP·Filed 2002·Granted Mar 29, 2005·94 cites·13 claims
- 0294US7023074B2Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)NAT SEMICONDUCTOR CORP·Filed 2005·Granted Apr 4, 2006·32 cites·6 claims
- 0394US6399415B1Electrical isolation in panels of leadless IC packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jun 4, 2002·145 cites·10 claims
- 0492US6452255B1Low inductance leadless packageNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 17, 2002·103 cites·11 claims
- 0578US6686652B1Locking lead tips and die attach pad for a leadless package apparatus and methodNAT SEMICONDUCTOR CORP·Filed 2000·Granted Feb 3, 2004·31 cites·29 claims
- 0666US6467278B1Cooling for singulation of composite materials in molded semiconductor packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Oct 22, 2002·16 cites·20 claims
- 0764US6629880B1Rotary mechanical buffing method for deflashing of molded integrated circuit packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Oct 7, 2003·14 cites·26 claims
- 0845US7181835B2Universal clamping mechanismNAT SEMICONDUCTOR CORP·Filed 2004·Granted Feb 27, 2007·1 cites·11 claims
- 0938US6698088B2Universal clamping mechanismNAT SEMICONDUCTOR CORP·Filed 2001·Granted Mar 2, 2004·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →