Inventor · disambiguated record
Ai-Tee Ang
Also filed as: ANG AI-TEE
23 granted patents·4 pending applications·108 citations·filing 2012–2024
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21TAIWAN SEMICONDUCTOR MFG2ADVANCED MICRO DEVICES INC1CHEN MENG-TSE1LIN CHENG-CHUNG1
Top patents by PatentIndex Score
27 records- 0198US9418971B2Package-on-package structure including a thermal isolation material and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 16, 2016·42 cites·20 claims
- 0296US9768048B2Package on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·26 cites·20 claims
- 0389US9437564B2Interconnect structure and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 6, 2016·11 cites·21 claims
- 0488US8900922B2Fine-pitch package-on-package structures and methods for forming the sameLIN CHENG-CHUNG·Filed 2012·Granted Dec 2, 2014·11 cites·14 claims
- 0584US10475679B2Semiconductor processing boat design with pressure sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·2 cites·20 claims
- 0684US2024395767A1Tools and systems for processing semiconductor devices, and methods of processing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0783US9373603B2Reflow process and toolTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 21, 2016·6 cites·18 claims
- 0880US10622240B2Package on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 14, 2020·2 cites·20 claims
- 0978US2023378153A1Package-on-Package Structure Including a Thermal Isolation MaterialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1077US12142594B2Tools and systems for processing semiconductor devices, and methods of processing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·19 claims
- 1176US9888527B2Systems for processing semiconductor devices, and methods of processing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 6, 2018·2 cites·20 claims
- 1275US9911633B2Semiconductor processing boat design with pressure sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·1 cites·20 claims
- 1371US9427818B2Semiconductor processing boat design with pressure sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 30, 2016·1 cites·20 claims
- 1467US11532498B2Package-on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 1567US10734263B2Semiconductor processing boat design with pressure sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 1667US8853002B2Methods for metal bump die assemblyTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 7, 2014·2 cites·20 claims
- 1766US8846448B2Warpage control in a package-on-package structureCHEN MENG-TSE·Filed 2012·Granted Sep 30, 2014·2 cites·13 claims
- 1864US11776945B2Package-on-package structure including a thermal isolation materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 3, 2023·0 cites·20 claims
- 1960US11355471B2System for processing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 7, 2022·0 cites·20 claims
- 2057US10109612B2Tools and systems for processing semiconductor devices, and methods of processing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 23, 2018·0 cites·20 claims
- 2156US10490539B2Package on-package structure including a thermal isolation material and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 26, 2019·0 cites·11 claims
- 2254US10867953B2Manufacturing method of integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 2352US11239103B2Package-on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 2451US10276537B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·13 claims
- 2546US9576888B2Package on-package joint structure with molding open bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 21, 2017·0 cites·20 claims
- 2646US2014042622A1Fine Pitch Package-on-Package StructureTSAI TSAI-TSUNG·Filed 2012·Application pending·0 cites
- 2746US2022208559A1Method and apparatus for chip manufacturingADVANCED MICRO DEVICES INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →