Inventor · disambiguated record
Aizo Kaneda
Also filed as: KANEDA AIZO · OBARA ISAO
50 granted patents·2,162 citations·filing 1977–2004
99Inventor score
Top patents by PatentIndex Score
50 records- 0198US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0297US5198888ASemiconductor stacked deviceHITACHI LTD·Filed 1990·Granted Mar 30, 1993·353 cites·11 claims
- 0394US5028986ASemiconductor device and semiconductor module with a plurality of stacked semiconductor devicesHITACHI LTD·Filed 1988·Granted Jul 2, 1991·115 cites·34 claims
- 0492US5334875AStacked semiconductor memory device and semiconductor memory module containing the sameHITACHI LTD·Filed 1993·Granted Aug 2, 1994·128 cites·56 claims
- 0592US4484796AOptical fiber connectorHITACHI LTD·Filed 1981·Granted Nov 27, 1984·134 cites·9 claims
- 0689US6265782B1Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated filmHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jul 24, 2001·99 cites·37 claims
- 0789US5219765AMethod for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication processHITACHI LTD·Filed 1990·Granted Jun 15, 1993·160 cites·22 claims
- 0889US5184208ASemiconductor deviceHITACHI LTD·Filed 1991·Granted Feb 2, 1993·115 cites·34 claims
- 0987US5059559AMethod of aligning and bonding tab inner leadsHITACHI LTD·Filed 1988·Granted Oct 22, 1991·88 cites·21 claims
- 1086US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 1186US4126292AMold dieHITACHI LTD·Filed 1977·Granted Nov 21, 1978·51 cites·2 claims
- 1285US4411609AApparatus for molding plasticHITACHI LTD·Filed 1981·Granted Oct 25, 1983·51 cites·10 claims
- 1384US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 1482US6621170B2Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive filmHITACHI CHEMICAL CO LTD·Filed 2001·Granted Sep 16, 2003·29 cites·29 claims
- 1580US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 1680US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 1780US4802831AFluid machine with resin-coated scroll membersHITACHI LTD·Filed 1987·Granted Feb 7, 1989·46 cites·19 claims
- 1879US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 1978US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 2077US4426341ATransfer molding method and transfer molding machineHITACHI LTD·Filed 1982·Granted Jan 17, 1984·34 cites·6 claims
- 2174US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 2272US4753515AMethod for assembling flat type plastic multifiber connectorsHITACHI CONSTRUCTION MACHINERY·Filed 1986·Granted Jun 28, 1988·32 cites·2 claims
- 2369US6130114ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 10, 2000·17 cites·22 claims
- 2469US6018191ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 25, 2000·18 cites·23 claims
- 2567US6531760B1Semiconductor deviceFiled 2000·Granted Mar 11, 2003·6 cites·8 claims
- 2667US5914530ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 22, 1999·15 cites·12 claims
- 2767US4946633AMethod of producing semiconductor devicesHITACHI LTD·Filed 1988·Granted Aug 7, 1990·32 cites·25 claims
- 2866US4954301ATransfer molding process and an apparatus for the sameHITACHI LTD·Filed 1989·Granted Sep 4, 1990·31 cites·17 claims
- 2966US4900501AMethod and apparatus for encapsulating semi-conductorsHITACHI LTD·Filed 1986·Granted Feb 13, 1990·31 cites·4 claims
- 3063US6100580ASemiconductor device having all outer leads extending from one side of a resin memberHITACHI LTD·Filed 1998·Granted Aug 8, 2000·17 cites·19 claims
- 3163US6069029ASemiconductor device chip on lead and lead on chip manufacturingHITACHI LTD·Filed 1998·Granted May 30, 2000·13 cites·36 claims
- 3261US6072231ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 6, 2000·12 cites·40 claims
- 3360US4239944ASpider of loudspeakerHITACHI LTD·Filed 1979·Granted Dec 16, 1980·24 cites·4 claims
- 3459US5125821AResin flow and curing measuring deviceHITACHI LTD·Filed 1989·Granted Jun 30, 1992·19 cites·13 claims
- 3559US4786802AApparatus for measuring photoelasticityHITACHI LTD·Filed 1987·Granted Nov 22, 1988·19 cites·9 claims
- 3654US5110515AMethod of encapsulating semiconductor chipsHITACHI LTD·Filed 1989·Granted May 5, 1992·19 cites·6 claims
- 3753US6720208B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Apr 13, 2004·2 cites·13 claims
- 3851US5981315ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Nov 9, 1999·7 cites·37 claims
- 3951US5821606ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Oct 13, 1998·9 cites·45 claims
- 4050US5863817ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 26, 1999·7 cites·23 claims
- 4150US5365113ASemiconductor deviceHITACHI LTD·Filed 1993·Granted Nov 15, 1994·15 cites·11 claims
- 4249US5514905ASemiconductor deviceHITACHI LTD·Filed 1994·Granted May 7, 1996·13 cites·18 claims
- 4344US6919622B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Jul 19, 2005·0 cites·6 claims
- 4444US5742101ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Apr 21, 1998·9 cites·25 claims
- 4541US6204552B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Mar 20, 2001·0 cites·15 claims
- 4637US6124629ASemiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chipHITACHI LTD·Filed 1998·Granted Sep 26, 2000·3 cites·9 claims
- 4734US4810089APhotoelastic effect measuring deviceHITACHI LTD·Filed 1987·Granted Mar 7, 1989·6 cites·10 claims
- 4832US6100115ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 8, 2000·1 cites·9 claims
- 4929US4524369APlastic information-recording mediumHITACHI LTD·Filed 1982·Granted Jun 18, 1985·0 cites·9 claims
- 5026US4322593AApparatus for pre-heating resin tabletHITACHI LTD·Filed 1979·Granted Mar 30, 1982·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →