Inventor · disambiguated record

Ai-Hua Liang

Also filed as: LIANG AI-HUA

1 granted patent·0 citations·filing 2013–2013

8Inventor score

Technology areasH05K

Files withAMBIT MICROSYSTEMS ZHONGSHAN LTD1

Top patents by PatentIndex Score

1 record

0133US9392693B2Method for manufacturing printed circuit board with shallow solder padAMBIT MICROSYSTEMS ZHONGSHAN LTD·Filed 2013·Granted Jul 12, 2016·0 cites·3 claims

Join the waitlist — get patent alerts

Get an alert when Ai-Hua Liang files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →