Inventor · disambiguated record
Ai Takamori
Also filed as: TAKAMORI AI
11 granted patents·13 pending applications·6 citations·filing 2011–2024
81Inventor score
Top patents by PatentIndex Score
24 records- 0192US10077383B2Hot melt adhesiveHENKEL AG & CO KGAA·Filed 2016·Granted Sep 18, 2018·4 cites·3 claims
- 0281US10858556B2Urethane adhesiveHENKEL AG & CO KGAA·Filed 2017·Granted Dec 8, 2020·1 cites·9 claims
- 0378US10513639B2Hot melt adhesiveHENKEL AG & CO KGAA·Filed 2016·Granted Dec 24, 2019·1 cites·4 claims
- 0473US12134719B2Hot-melt adhesiveHENKEL AG & CO KGAA·Filed 2021·Granted Nov 5, 2024·0 cites·3 claims
- 0573US10190027B2Hot melt adhesiveHENKEL AG & CO KGAA·Filed 2018·Granted Jan 29, 2019·0 cites·4 claims
- 0671US12173206B2Alkali-dispersible hot melt pressure-sensitive adhesiveHENKEL AG & CO KGAA·Filed 2022·Granted Dec 24, 2024·0 cites·4 claims
- 0771US2024368433A1Hot melt adhesiveHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 0868US2023312997A1Hot melt adhesiveHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0968US2023303897A1Hot melt adhesiveHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 1065US12480023B2Hot-melt adhesiveHENKEL AG & CO KGAA·Filed 2021·Granted Nov 25, 2025·0 cites·14 claims
- 1163US2022298392A1Alkali-dispersible hot melt pressure-sensitive adhesiveHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 1262US9790409B2Hot melt adhesiveHENKEL AG & CO KGAA·Filed 2015·Granted Oct 17, 2017·0 cites·9 claims
- 1360US9550922B2Hot-melt adhesive for electric instrumentsHENKEL AG & CO KGAA·Filed 2014·Granted Jan 24, 2017·0 cites·8 claims
- 1458US11236257B2Moisture-curable hot melt adhesiveHENKEL AG & CO KGAA·Filed 2018·Granted Feb 1, 2022·0 cites·13 claims
- 1558US2015114583A1Hot melt adhesiveHENKEL AG & CO KGAA·Filed 2014·Application pending·0 cites
- 1658US2015112012A1Hot melt adhesiveHENKEL AG & CO KGAA·Filed 2014·Application pending·0 cites
- 1757US2020087543A1Moisture-Curable Hot-Melt Adhesive AgentHENKEL AG & CO KGAA·Filed 2019·Application pending·0 cites
- 1854US2020095471A1Moisture-Curable Hot-Melt Adhesive AgentHENKEL AG & CO KGAA·Filed 2019·Application pending·0 cites
- 1954US2013345355A1Hot melt adhesiveHENKEL AG & CO KGAA·Filed 2013·Application pending·0 cites
- 2054US2020087542A1Moisture-Curable Hot-Melt Adhesive AgentHENKEL AG & CO KGAA·Filed 2019·Application pending·0 cites
- 2151US10919264B2Adhesive sheetHENKEL AG & CO KGAA·Filed 2014·Granted Feb 16, 2021·0 cites·13 claims
- 2248US2014023870A1Hot melt adhesiveTAKAMORI AI·Filed 2011·Application pending·0 cites
- 2347US2019085223A1Urethane adhesiveHENKEL AG & CO KGAA·Filed 2018·Application pending·0 cites
- 2443US2012142885A1Moisture-curable hot melt adhesive for ic cardMATSUKI YUICHI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →