Inventor · disambiguated record
Aik Chong Tan
Also filed as: TAN AIK CHONG
3 granted patents·34 citations·filing 2000–2000
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0174US6864423B2Bump chip lead frame and packageSEMICONDUCTOR COMPONENT IND L·Filed 2000·Granted Mar 8, 2005·31 cites·9 claims
- 0244US6392288B1Lead frame for assembly for thin small outline plastic encapsulated packagesSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted May 21, 2002·2 cites·2 claims
- 0339US6376266B1Semiconductor package and method for forming sameSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Apr 23, 2002·1 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →