Inventor · disambiguated record
Aiping Tan
Also filed as: TAN AIPING
9 granted patents·2 pending applications·13 citations·filing 2016–2021
82Inventor score
Top patents by PatentIndex Score
11 records- 0190US10991679B2Stair-stacked dice device in a system in package, and methods of making sameINTEL CORP·Filed 2020·Granted Apr 27, 2021·2 cites·20 claims
- 0289US10930622B2Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making sameINTEL CORP·Filed 2020·Granted Feb 23, 2021·2 cites·21 claims
- 0378US11538746B2Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making sameINTEL CORP·Filed 2016·Granted Dec 27, 2022·3 cites·17 claims
- 0478US10770434B2Stair-stacked dice device in a system in package, and methods of making sameINTEL CORP·Filed 2016·Granted Sep 8, 2020·2 cites·21 claims
- 0578US10727208B2Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making sameINTEL CORP·Filed 2016·Granted Jul 28, 2020·2 cites·25 claims
- 0676US11081451B2Die stack with reduced warpageINTEL CORP·Filed 2017·Granted Aug 3, 2021·2 cites·23 claims
- 0767US11848281B2Die stack with reduced warpageINTEL CORP·Filed 2021·Granted Dec 19, 2023·0 cites·18 claims
- 0864US11652087B2Interposer design in package structures for wire bonding applicationsTAHOE RES LTD·Filed 2021·Granted May 16, 2023·0 cites·19 claims
- 0949US10971478B2Interposer design in package structures for wire bonding applicationsINTEL CORP·Filed 2016·Granted Apr 6, 2021·0 cites·23 claims
- 1036US2019355700A1Techniques for windowed substrate integrated circuit packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 1135US2019371766A1Integrated circuit die stacksINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →