Inventor · disambiguated record
Aira Lourdes Villamor
Also filed as: VILLAMOR AIRA LOURDES BARING · VILLAMOR Aira Lourdes
6 granted patents·4 pending applications·2 citations·filing 2016–2025
70Inventor score
Top patents by PatentIndex Score
10 records- 0173US9978668B1Packaged semiconductor devices with laser grooved wettable flank and methods of manufactureFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted May 22, 2018·2 cites·20 claims
- 0272US2024234155A1Singulation of silicon carbide semiconductor wafersSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0369US11942327B2Singulation of silicon carbide semiconductor wafersSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Mar 26, 2024·0 cites·20 claims
- 0457US10818582B2Packaged semiconductor devices with laser grooved wettable flank and methods of manufactureFAIRCHILD SEMICONDUCTOR·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 0555US2025054842A1Package with concave wettability and/or metallization layerINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0654US11309188B2Singulation of silicon carbide semiconductor wafersSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Apr 19, 2022·0 cites·12 claims
- 0752US10483192B2Packaged semiconductor devices with laser grooved wettable flank and methods of manufactureFAIRCHILD SEMICONDUCTOR·Filed 2018·Granted Nov 19, 2019·0 cites·19 claims
- 0852US2025391744A1Semiconductor device including a coined diepadINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0945US2025316566A1Encapsulated package with carrier having retracted lateral extension laterally covered by encapsulantINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1037US9685398B2Thin semiconductor device packagesFAIRCHILD SEMICONDUCTOR·Filed 2016·Granted Jun 20, 2017·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →