Inventor · disambiguated record
Aibin Yu
Also filed as: YU AIBIN
17 granted patents·4 pending applications·48 citations·filing 2012–2024
92Inventor score
Files withMICRON TECHNOLOGY INC17GUANGZHOU BIOSEAL BIOTECH CO LTD2MA ZHAOHUI1OMRIX BIOPHARMACEUTICALS LTD1
Top patents by PatentIndex Score
21 records- 0193US9349670B2Semiconductor die assemblies with heat sink and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted May 24, 2016·11 cites·16 claims
- 0286US9865578B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 9, 2018·4 cites·21 claims
- 0385US9589933B2Methods of processing wafer-level assemblies to reduce warpage, and related assembliesMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 7, 2017·6 cites·20 claims
- 0484US9202714B2Methods for forming semiconductor device packagesMA ZHAOHUI·Filed 2012·Granted Dec 1, 2015·11 cites·20 claims
- 0583US10153178B2Semiconductor die assemblies with heat sink and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 11, 2018·2 cites·18 claims
- 0683US2024429190A1Bond pad with micro-protrusions for direct metallic bondingMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0782US9786612B2Methods of processing wafer-level assemblies to reduce warpage, and related assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 10, 2017·3 cites·20 claims
- 0881US10103134B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 16, 2018·2 cites·20 claims
- 0981US9716019B2Semiconductor die assemblies with heat sink and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Jul 25, 2017·2 cites·23 claims
- 1079US10923448B2Bond pad with micro-protrusions for direct metallic bondingMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 16, 2021·2 cites·11 claims
- 1178US10312226B2Semiconductor devices comprising protected side surfaces and related methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 4, 2019·2 cites·20 claims
- 1276US9786643B2Semiconductor devices comprising protected side surfaces and related methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Oct 10, 2017·3 cites·11 claims
- 1371US12087719B2Bond pad with micro-protrusions for direct metallic bondingMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 10, 2024·0 cites·9 claims
- 1462US10636678B2Semiconductor die assemblies with heat sink and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 28, 2020·0 cites·20 claims
- 1560US10734370B2Methods of making semiconductor devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 4, 2020·0 cites·18 claims
- 1658US2022111020A1Hemostatic compositions and methods of making thereofGUANGZHOU BIOSEAL BIOTECH CO LTD·Filed 2021·Application pending·0 cites
- 1756US2016093583A1Bond pad with micro-protrusions for direct metallic bondingMICRON TECHNOLOGY INC·Filed 2014·Application pending·0 cites
- 1850US12255128B2Silicon spacers with improved adhesion and semiconductor device assemblies incorporating the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 18, 2025·0 cites·10 claims
- 1950US11413335B2Hemostatic compositions and methods of making thereofGUANGZHOU BIOSEAL BIOTECH CO LTD·Filed 2018·Granted Aug 16, 2022·0 cites·5 claims
- 2049US9337064B2Methods of protecting peripheries of in-process semiconductor wafers and related in-process wafers and systemsMICRON TECHNOLOGY INC·Filed 2014·Granted May 10, 2016·0 cites·16 claims
- 2149US2022411776A1Pro-thrombin purificationOMRIX BIOPHARMACEUTICALS LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →