Inventor · disambiguated record
Ajay P. Giri
Also filed as: GIRI AJAY P · GIRI AJAY PRABHAKAR
21 granted patents·1 pending application·550 citations·filing 1990–2009
96Inventor score
Top patents by PatentIndex Score
22 records- 0197US5931222AAdhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using sameIBM·Filed 1997·Granted Aug 3, 1999·150 cites·13 claims
- 0289US8003512B2Structure of UBM and solder bumps and methods of fabricationIBM·Filed 2009·Granted Aug 23, 2011·19 cites·19 claims
- 0389US6037044ADirect deposit thin film single/multi chip moduleIBM·Filed 1998·Granted Mar 14, 2000·68 cites·24 claims
- 0487US6281452B1Multi-level thin-film electronic packaging structure and related methodIBM·Filed 1998·Granted Aug 28, 2001·53 cites·21 claims
- 0583US5912044AMethod for forming thin film capacitorsIBM·Filed 1997·Granted Jun 15, 1999·54 cites·15 claims
- 0680US6678949B2Process for forming a multi-level thin-film electronic packaging structureIBM·Filed 2001·Granted Jan 20, 2004·21 cites·8 claims
- 0777US6451155B1Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assemblyIBM·Filed 1996·Granted Sep 17, 2002·31 cites·10 claims
- 0872US6261467B1Direct deposit thin film single/multi chip moduleIBM·Filed 1999·Granted Jul 17, 2001·26 cites·11 claims
- 0967US6291272B1Structure and process for making substrate packages for high frequency applicationIBM·Filed 1999·Granted Sep 18, 2001·33 cites·32 claims
- 1065US8314500B2Interconnections for flip-chip using lead-free solders and having improved reaction barrier layersBELANGER LUC·Filed 2006·Granted Nov 20, 2012·4 cites·1 claims
- 1163US6896784B2Method for controlling local current to achieve uniform plating thicknessIBM·Filed 2004·Granted May 24, 2005·8 cites·6 claims
- 1261US6765152B2Multichip module having chips on two sidesIBM·Filed 2002·Granted Jul 20, 2004·9 cites·13 claims
- 1359US7932169B2Interconnection for flip-chip using lead-free solders and having improved reaction barrier layersIBM·Filed 2009·Granted Apr 26, 2011·1 cites·3 claims
- 1458US5135595AProcess for fabricating a low dielectric composite substrateIBM·Filed 1990·Granted Aug 4, 1992·24 cites·9 claims
- 1557US6890413B2Method and apparatus for controlling local current to achieve uniform plating thicknessIBM·Filed 2002·Granted May 10, 2005·6 cites·13 claims
- 1653US6235412B1Corrosion-resistant terminal metal pads for thin film packagesIBM·Filed 2000·Granted May 22, 2001·4 cites·16 claims
- 1751US5277725AProcess for fabricating a low dielectric composite substrateIBM·Filed 1992·Granted Jan 11, 1994·17 cites·15 claims
- 1850US5370974ALaser exposure of photosensitive polyimide for pattern formationIBM·Filed 1992·Granted Dec 6, 1994·11 cites·8 claims
- 1942US5270151ASpin on oxygen reactive ion etch barrierIBM·Filed 1992·Granted Dec 14, 1993·6 cites·6 claims
- 2041US6973715B2Method of forming a multichip module having chips on two sidesIBM·Filed 2003·Granted Dec 13, 2005·0 cites·6 claims
- 2141US2005167284A1Electrolytic method for photoresist strippingIBM·Filed 2004·Application pending·0 cites
- 2237US6083375AProcess for producing corrosion-resistant terminal metal pads for thin film packagesIBM·Filed 1998·Granted Jul 4, 2000·5 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →