Inventor · disambiguated record
Akira Fukui
Also filed as: FUKUI AKIRA
38 granted patents·25 pending applications·398 citations·filing 1982–2023
97Inventor score
Top patents by PatentIndex Score
63 records- 0197US5876027ASheet bundle folding apparatusCANON APTEX INC·Filed 1996·Granted Mar 2, 1999·119 cites·20 claims
- 0282US4457780AElectric contact materialsSUMITOMO ELECTRIC INDUSTRIES·Filed 1982·Granted Jul 3, 1984·22 cites·8 claims
- 0380US10891765B2Information processing apparatus and information processing methodSONY CORP·Filed 2017·Granted Jan 12, 2021·3 cites·17 claims
- 0480US6388273B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted May 14, 2002·21 cites·1 claims
- 0576US7749430B2Member for semiconductor device and production method thereofALMT CORP·Filed 2006·Granted Jul 6, 2010·7 cites·10 claims
- 0675US6737168B1Composite material and semiconductor device using the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted May 18, 2004·19 cites·12 claims
- 0774US6507105B1Member for semiconductor device and method for producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted Jan 14, 2003·20 cites·6 claims
- 0873US6280496B1Silicon carbide based composite material and manufacturing method thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 1999·Granted Aug 28, 2001·42 cites·30 claims
- 0972US6183874B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Feb 6, 2001·28 cites·14 claims
- 1067US6534190B1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted Mar 18, 2003·9 cites·18 claims
- 1166US8430503B2Inkjet dyeing methodFUKUI AKIRA·Filed 2011·Granted Apr 30, 2013·1 cites·6 claims
- 1265US9708936B2CondenserMITSUBISHI HITACHI POWER SYS·Filed 2013·Granted Jul 18, 2017·2 cites·5 claims
- 1362US4797931AAudio frequency signal identification apparatusKOKUSAI DENSHIN DENWA CO LTD·Filed 1987·Granted Jan 10, 1989·26 cites·4 claims
- 1461US6876075B2Aluminum-silicon carbide semiconductor substrate and method for producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2001·Granted Apr 5, 2005·6 cites·12 claims
- 1561US6123895AAluminum base member for semiconductor device containing a nitrogen rich surface and method for producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1999·Granted Sep 26, 2000·24 cites·23 claims
- 1658US12442840B2Current sensor and electric deviceALPS ALPINE CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·8 claims
- 1757US6921193B2Chemical concentration control device for semiconductor processing apparatusKAIJO KK·Filed 2002·Granted Jul 26, 2005·5 cites·4 claims
- 1856US9638469B2Condenser, multistage pressure condenser provided therewith, and reheating module used in condenserMITSUBISHI HITACHI POWER SYS·Filed 2014·Granted May 2, 2017·0 cites·20 claims
- 1956US6974558B2Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMOTOMO ELECTRIC IND LTD·Filed 2001·Granted Dec 13, 2005·5 cites·9 claims
- 2055US2022076671A1Information processing terminal, information processing apparatus, and information processing methodSONY GROUP CORP·Filed 2019·Application pending·0 cites
- 2153US2025381662A1Information processing device, information processing method, and programSONY GROUP CORP·Filed 2023·Application pending·0 cites
- 2252US11615476B2Information processing device and methodSONY CORP·Filed 2017·Granted Mar 28, 2023·0 cites·17 claims
- 2352US6764773B2Heat-dissipating substrate, method for making the same, and semiconductor device including the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted Jul 20, 2004·6 cites·20 claims
- 2451US2009186004A1Method For Preparing An Organ For TransplantationSTEMCELL INST INC·Filed 2007·Application pending·0 cites
- 2550US10949712B2Information processing method and information processing deviceSONY CORP·Filed 2016·Granted Mar 16, 2021·0 cites·18 claims
- 2650US2019057309A1Information processing apparatus and information processing methodSONY CORP·Filed 2017·Application pending·0 cites
- 2749US11392092B2Information processing device and information processing methodSONY CORP·Filed 2018·Granted Jul 19, 2022·0 cites·17 claims
- 2849US11086678B2Information processing device, method of processing information, and method of providing informationSONY CORP·Filed 2016·Granted Aug 10, 2021·0 cites·19 claims
- 2949US8220921B2Inkjet dyeing apparatusFUKUI AKIRA·Filed 2009·Granted Jul 17, 2012·0 cites·12 claims
- 3048US7392812B2Substrate processing apparatus and substrate transporting device mounted theretoKAIJO KK·Filed 2003·Granted Jul 1, 2008·7 cites·20 claims
- 3147US11984121B2Information processing device to stop the turn off of power based on voice input for voice operationSONY GROUP CORP·Filed 2020·Granted May 14, 2024·0 cites·12 claims
- 3247US8092914B2Heat sink substrate and production method for the sameOMACHI MASAHIRO·Filed 2007·Granted Jan 10, 2012·1 cites·4 claims
- 3347US2025142214A1Mobile apparatus, information processing program, and information processing methodSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 3446US10803058B2Information processing device, method of processing information, and method of providing informationSONY CORP·Filed 2017·Granted Oct 13, 2020·0 cites·22 claims
- 3546US2024370026A1Mobile object, information processing method, information processing system, and computer programSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 3645US9957637B2Method of producing epitaxial waferSUMCO CORP·Filed 2014·Granted May 1, 2018·0 cites·7 claims
- 3744US2022108693A1Response processing device and response processing methodSONY GROUP CORP·Filed 2019·Application pending·0 cites
- 3843US11593635B2Information processing device, method of processing information, and method of providing informationSONY CORP·Filed 2017·Granted Feb 28, 2023·0 cites·21 claims
- 3942US5001759AMethod and apparatus for speech codingNEC CORP·Filed 1989·Granted Mar 19, 1991·15 cites·1 claims
- 4042US2019362433A1Information processing apparatus and method, program, and information processing systemSONY CORP·Filed 2018·Application pending·0 cites
- 4142US2022293010A1Information processing apparatus and information processing methodSONY GROUP CORP·Filed 2019·Application pending·0 cites
- 4242US2022351600A1Information processing apparatus, information processing method, and information processing programSONY GROUP CORP·Filed 2020·Application pending·0 cites
- 4342US2019317514A1Information processing apparatus and information processing methodSONY CORP·Filed 2018·Application pending·0 cites
- 4442US2005025654A1Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Application pending·0 cites
- 4541US2019370641A1Information processing apparatusSONY CORP·Filed 2018·Application pending·0 cites
- 4641US2022122600A1Information processing device and information processing methodSONY GROUP CORP·Filed 2019·Application pending·0 cites
- 4741US2020263994A1Information processing apparatus, information processing method, program, and moving bodySONY CORP·Filed 2018·Application pending·0 cites
- 4840US12119322B2Bonding member for semiconductor deviceSUPERUFO291 TEC·Filed 2021·Granted Oct 15, 2024·0 cites·6 claims
- 4940US11936718B2Information processing device and information processing methodSONY GROUP CORP·Filed 2020·Granted Mar 19, 2024·0 cites·12 claims
- 5040US2019025071A1Information processing deviceSONY CORP·Filed 2016·Application pending·0 cites
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →