Inventor · disambiguated record
Akihiro Fukui
Also filed as: FUKUI AKIHIRO
7 granted patents·9 pending applications·32 citations·filing 1989–2025
80Inventor score
Top patents by PatentIndex Score
16 records- 0181US7415343B2Engine controllerMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Aug 19, 2008·13 cites·8 claims
- 0279US10014235B2Underfill material, laminated sheet and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2015·Granted Jul 3, 2018·3 cites·5 claims
- 0371US5089628AFluorine-containing bismaleamic acids and bismaleimides useful for thermosetting resinsCENTRAL GLASS CO LTD·Filed 1989·Granted Feb 18, 1992·11 cites·6 claims
- 0467US7199262B23-Hydroxypropyl ester of 2-trifluoromethylacrylic acid and process for producing sameCENTRAL GLASS CO LTD·Filed 2005·Granted Apr 3, 2007·1 cites·19 claims
- 0564US9679797B2Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2015·Granted Jun 13, 2017·1 cites·4 claims
- 0645US2025253183A1Pressure-sensitive adhesive tape for semiconductor wafer processingNITTO DENKO CORP·Filed 2025·Application pending·0 cites
- 0744US2016240394A1Semiconductor Device Manufacturing MethodNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0844US2016240523A1Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin Composition, and Dicing Tape-Integrated Sheet-Shaped Resin CompositionNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0944US2016233184A1Semiconductor Device Manufacturing MethodNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1043US2016035640A1Underfill film, sealing sheet, method of manufacturing semiconductor device, and semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1143US2016013089A1Semiconductor device production method, sheet-shaped resin composition, dicing tape-integrated sheet-shaped resin compositionNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1243US2016075871A1Thermosetting resin composition and method for producing a semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1342US2016040045A1Adhesive film for underfill, adhesive film for underfill integrated with tape for grinding rear surface, adhesive film for underfill integrated with dicing tape, and semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1442US2015380277A1Underfill sheet, underfill sheet integrated with tape for grinding rear surface, underfill sheet integrated with dicing tape, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1539US5098971AFluorine-containing thermosetting resinHITACHI LTD·Filed 1990·Granted Mar 24, 1992·3 cites·5 claims
- 1633US10141217B2Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2015·Granted Nov 27, 2018·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →