Inventor · disambiguated record

Akira Furuzawa

Also filed as: FURUZAWA AKIRA

2 granted patents·196 citations·filing 1994–1996

71Inventor score

Technology areasH10W

Files withKYOCERA CORP2

Top patents by PatentIndex Score

2 records

0185US5547908ADielectric ceramic composition and package made of the same composition for packaging semiconductorKYOCERA CORP·Filed 1994·Granted Aug 20, 1996·106 cites·13 claims
0281US5767564ASemiconductor device with a decoupling capacitor mounted thereon having a thermal expansion coefficient matched to the deviceKYOCERA CORP·Filed 1996·Granted Jun 16, 1998·90 cites·4 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →