Inventor · disambiguated record
Akihiro Hakamata
Also filed as: HAKAMATA Akihiro
8 granted patents·15 pending applications·8 citations·filing 2017–2025
76Inventor score
Files withFUJIFILM CORP23
Top patents by PatentIndex Score
23 records- 0194US10487210B2Coloring composition for textile printing, textile printing method, ink for ink jet textile printing, and dyed fabricFUJIFILM CORP·Filed 2017·Granted Nov 26, 2019·6 cites·11 claims
- 0280US11710641B2Kit, composition for forming underlayer film for imprinting, pattern forming method, and method for manufacturing semiconductor deviceFUJIFILM CORP·Filed 2020·Granted Jul 25, 2023·1 cites·22 claims
- 0378US11703759B2Transfer film, electrode protective film, laminate, capacitive input device, and manufacturing method of touch panelFUJIFILM CORP·Filed 2020·Granted Jul 18, 2023·1 cites·22 claims
- 0467US2025376760A1Composition for treating semiconductor device, method for manufacturing modified substrate, and method for manufacturing laminateFUJIFILM CORP·Filed 2025·Application pending·0 cites
- 0562US12421343B2Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film, kit, pattern producing method, and method for manufacturing semiconductor elementFUJIFILM CORP·Filed 2021·Granted Sep 23, 2025·0 cites·16 claims
- 0661US2024337013A1Chemical liquid, manufacturing method of modified substrate, manufacturing method of laminate, and chemical liquid containerFUJIFILM CORP·Filed 2024·Application pending·0 cites
- 0760US12242185B2Curable composition, kit, interlayer, laminate, imprint pattern producing method, and method for manufacturing deviceFUJIFILM CORP·Filed 2022·Granted Mar 4, 2025·0 cites·7 claims
- 0860US2024368753A1Chemical liquid, manufacturing method of modified substrate, and manufacturing method of laminateFUJIFILM CORP·Filed 2024·Application pending·0 cites
- 0958US2023109153A1Curable composition for imprinting, coating film, method for producing film, cured product, method for producing imprint pattern, and method for producing deviceFUJIFILM CORP·Filed 2022·Application pending·0 cites
- 1057US12109752B2Composition for forming underlayer film in imprinting method, kit, pattern producing method, laminate, and method for manufacturing semiconductor elementFUJIFILM CORP·Filed 2021·Granted Oct 8, 2024·0 cites·18 claims
- 1157US2025230321A1Semiconductor device processing composition, compound, method for producing modified substrate, and method for producing semiconductor deviceFUJIFILM CORP·Filed 2025·Application pending·0 cites
- 1257US2023058755A1Curable composition for imprinting, cured product, method for producing imprint pattern, and method for producing deviceFUJIFILM CORP·Filed 2022·Application pending·0 cites
- 1356US2025230539A1Method for manufacturing modified substrate and method for manufacturing semiconductor deviceFUJIFILM CORP·Filed 2025·Application pending·0 cites
- 1454US2023383044A1Composition for forming imprint pattern, cured substance, imprint pattern producing method, device, and method for manufacturing deviceFUJIFILM CORP·Filed 2023·Application pending·0 cites
- 1554US2023250311A1Method for producing composition for forming interlayer for nanoimprint, method for producing laminate, imprint pattern producing method, and method for manufacturing deviceFUJIFILM CORP·Filed 2023·Application pending·0 cites
- 1653US12091497B2Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film for imprinting, pattern producing method, method for manufacturing semiconductor element, cured product, and kitFUJIFILM CORP·Filed 2021·Granted Sep 17, 2024·0 cites·23 claims
- 1753US2025215024A1Chemical liquid, manufacturing method of modified substrate, and manufacturing method of laminateFUJIFILM CORP·Filed 2025·Application pending·0 cites
- 1852US2023219280A1Method for producing composition for forming imprint pattern, method for producing cured substance, imprint pattern producing method, and method for manufacturing deviceFUJIFILM CORP·Filed 2023·Application pending·0 cites
- 1950US2022380505A1Composition for forming imprint pattern, cured substance, imprint pattern producing method, and method for manufacturing deviceFUJIFILM CORP·Filed 2022·Application pending·0 cites
- 2050US2022204814A1Composition for forming adhesive film, adhesive film, laminate, method for manufacturing laminate, pattern producing method, and method for manufacturing semiconductor elementFUJIFILM CORP·Filed 2022·Application pending·0 cites
- 2149US11899361B2Kit, composition for forming underlayer film for imprinting, laminate, and production method using the sameFUJIFILM CORP·Filed 2020·Granted Feb 13, 2024·0 cites·19 claims
- 2249US2022009153A1Composition for forming pattern, kit, cured film, laminate, pattern producing method, and method for manufacturing semiconductor elementFUJIFILM CORP·Filed 2021·Application pending·0 cites
- 2345US2021018833A1Curable composition for imprinting, release agent, cured product, pattern forming method, and lithography methodFUJIFILM CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →