Inventor · disambiguated record
Akihiko Happoya
Also filed as: HAPPOYA AKIHIKO
22 granted patents·30 pending applications·147 citations·filing 1997–2021
94Inventor score
Top patents by PatentIndex Score
52 records- 0192US8581291B2Semiconductor device and method for manufacturing the sameSHIMOKAWA KAZUO·Filed 2009·Granted Nov 12, 2013·33 cites·25 claims
- 0286US9793202B1Wireless apparatusTOSHIBA KK·Filed 2017·Granted Oct 17, 2017·5 cites·5 claims
- 0386US8058559B2Flexible printed circuit board and electronic apparatusMURO KIYOMI·Filed 2008·Granted Nov 15, 2011·20 cites·8 claims
- 0484US8906716B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2013·Granted Dec 9, 2014·3 cites·38 claims
- 0583US6084780APrinted circuit board with high electronic component densityTOSHIBA KK·Filed 1997·Granted Jul 4, 2000·55 cites·6 claims
- 0680US7419382B2Printed circuit board, electronic device, and manufacturing method for printed circuit boardTOSHIBA KK·Filed 2006·Granted Sep 2, 2008·9 cites·7 claims
- 0773US10163765B2Semiconductor device that includes a molecular bonding layer for bonding of elementsTOSHIBA KK·Filed 2017·Granted Dec 25, 2018·2 cites·13 claims
- 0872US10147612B2Metal pattern forming methodTOSHIBA KK·Filed 2017·Granted Dec 4, 2018·1 cites·16 claims
- 0972US9345134B2Printed wiring boardTOSHIBA KK·Filed 2014·Granted May 17, 2016·2 cites·19 claims
- 1071US8896761B2Television receiver and electronic deviceHAPPOYA AKIHIKO·Filed 2012·Granted Nov 25, 2014·3 cites·8 claims
- 1170US7361848B2Wiring board, magnetic disc apparatus, and manufacturing method of wiring boardTOSHIBA KK·Filed 2005·Granted Apr 22, 2008·4 cites·6 claims
- 1268US10249531B1Method for forming metal wiringTOSHIBA MEMORY CORP·Filed 2018·Granted Apr 2, 2019·1 cites·14 claims
- 1367US9595646B2Electronic component and electronic unitTOSHIBA KK·Filed 2014·Granted Mar 14, 2017·2 cites·17 claims
- 1465US9431588B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2014·Granted Aug 30, 2016·0 cites·4 claims
- 1559US10673125B2Wireless apparatusTOSHIBA KK·Filed 2019·Granted Jun 2, 2020·0 cites·11 claims
- 1659US8742264B2Electronic apparatusHAPPOYA AKIHIKO·Filed 2012·Granted Jun 3, 2014·1 cites·16 claims
- 1755US6973635B2Printed wiring board design aiding system, printed wiring board CAD system, and record mediumTOSHIBA KK·Filed 2003·Granted Dec 6, 2005·5 cites·11 claims
- 1854US9155203B2Apparatus for manufacturing flexible printed wiring board, apparatus for manufacturing wiring board, and applying deviceHAPPOYA AKIHIKO·Filed 2012·Granted Oct 6, 2015·1 cites·8 claims
- 1954US8039857B2Optical semiconductor device and method of manufacturing optical semiconductor deviceTOSHIBA KK·Filed 2009·Granted Oct 18, 2011·0 cites·6 claims
- 2054US2025171470A1Compound, bonding agent, bonded body, printed circuit board, and method for manufacturing bonded bodyDAICEL CORP·Filed 2021·Application pending·0 cites
- 2152US2014322841A1Light emitting element module substrate, light emitting element module, and illuminating deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2252US2019198421A1Heat radiating plate-lined ceramics substrateTOSHIBA KK·Filed 2018·Application pending·0 cites
- 2350US10355338B2Wireless apparatusTOSHIBA KK·Filed 2017·Granted Jul 16, 2019·0 cites·14 claims
- 2450US2010149823A1Lamp unit, circuit board, and method of manufaturing circuit boardHAPPOYA AKIHIKO·Filed 2009·Application pending·0 cites
- 2549US8035212B2Semiconductor chip mounting body, method of manufacturing semiconductor chip mounting body and electronic deviceTOSHIBA KK·Filed 2009·Granted Oct 11, 2011·0 cites·5 claims
- 2648US2015264290A1Camera moduleTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2747US2009159324A1Printed circuit board and method of producing the sameTOSHIBA KK·Filed 2008·Application pending·0 cites
- 2846US8241937B2Optical semiconductor device and method of manufacturing optical semiconductor deviceHAPPOYA AKIHIKO·Filed 2011·Granted Aug 14, 2012·0 cites·2 claims
- 2946US2009188702A1Flexible printed wiring board and electronic apparatusTOSHIBA KK·Filed 2008·Application pending·0 cites
- 3046US2015366069A1Apparatus for manufacturing flexible printed wiring board, apparatus for manufacturing wiring board, and applying deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 3146US2013037834A1Light emitting element module substrate, light emitting element module, and illuminating deviceTOSHIBA LIGHTING & TECHNOLOGY·Filed 2011·Application pending·0 cites
- 3245US2009168386A1Electronic apparatus and substrate mounting methodTOSHIBA KK·Filed 2008·Application pending·0 cites
- 3344US2015264797A1Electronic apparatusTOSHIBA KK·Filed 2014·Application pending·0 cites
- 3444US2006139902A1Double-sided component-mounted circuit board and method for manufacturing the sameTOSHIBA KK·Filed 2005·Application pending·0 cites
- 3543US2005279529A1Wiring board, magnetic disc apparatus, and production method of wiring boardTOSHIBA KK·Filed 2005·Application pending·0 cites
- 3642US2006023438A1Wiring board and method of manufacturing wiring boardHAPPOYA AKIHIKO·Filed 2005·Application pending·0 cites
- 3742US2022130644A1Plasma processing apparatus, plasma processing method, and conductive memberNOA LEADING CO LTD·Filed 2020·Application pending·0 cites
- 3841US2012250269A1Television receiver and electronic deviceHAPPOYA AKIHIKO·Filed 2011·Application pending·0 cites
- 3940US2005000730A1Printed wiring board, electronic component mounting method, and electronic apparatusTOSHIBA KK·Filed 2004·Application pending·0 cites
- 4040US2007200232A1Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic deviceSUZUKI DAIGO·Filed 2007·Application pending·0 cites
- 4138US2018274102A1Method of forming metal patternTOSHIBA KK·Filed 2017·Application pending·0 cites
- 4238US2003123234A1Printed wiring board having pads to solder circuit component, circuit module having the printed wiring board, and electronic apparatus equipped with the circuit moduleTOSHIBA KK·Filed 2002·Application pending·0 cites
- 4338US2003121699A1Multi-layered printed wiring board having via holes, circuit module comprising circuit elements mounted on the multi-layered printed wiring board, and method of manufacturing the multi-layered printed wiring boardTOSHIBA KK·Filed 2002·Application pending·0 cites
- 4437US2016143150A1Method of manufacturing a flexible printed circuit board including a solder resist layerTOSHIBA KK·Filed 2015·Application pending·0 cites
- 4537US2017294395A1Semiconductor device that includes a molecular bonding layer for bonding elementsTOSHIBA KK·Filed 2017·Application pending·0 cites
- 4637US2017294398A1Semiconductor device that includes a molecular bonding layer for bonding of elementsTOSHIBA KK·Filed 2017·Application pending·0 cites
- 4737US2017294408A1Semiconductor device that includes a molecular bonding layer for bonding elementsTOSHIBA KK·Filed 2017·Application pending·0 cites
- 4837US2016157392A1Electronic device module having a shield layerTOSHIBA KK·Filed 2015·Application pending·0 cites
- 4936US2016073495A1Method for manufacturing flexible printed circuit board module with reinforcing board, and intermediate structure of flexible printed circuit board moduleTOSHIBA KK·Filed 2015·Application pending·0 cites
- 5036US2017294394A1Semiconductor device having a molecular bonding layer for bonding elementsTOSHIBA KK·Filed 2017·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →