Inventor · disambiguated record
Akitoshi Hara
Also filed as: HARA AKITOSHI
14 granted patents·1 pending application·262 citations·filing 1990–2014
92Inventor score
Top patents by PatentIndex Score
15 records- 0193US6566232B1Method of fabricating semiconductor deviceSEIKO EPSON CORP·Filed 2000·Granted May 20, 2003·83 cites·19 claims
- 0288US7714484B2Piezoelectric resonator and manufacturing method thereforEPSON TOYOCOM CORP·Filed 2008·Granted May 11, 2010·19 cites·7 claims
- 0384US5498902ASemiconductor device and its manufacturing methodSEIKO EPSON CORP·Filed 1994·Granted Mar 12, 1996·81 cites·12 claims
- 0480US7859172B2Piezoelectric resonator, manufacturing method thereof and lid for piezoelectric resonatorEPSON TOYOCOM CORP·Filed 2008·Granted Dec 28, 2010·12 cites·14 claims
- 0564US5302850ASemiconductor sealing moldSEIKO EPSON CORP·Filed 1993·Granted Apr 12, 1994·30 cites·3 claims
- 0662US8643254B2Piezoelectric device with a package including a convex partISHIKAWA KATSUO·Filed 2010·Granted Feb 4, 2014·2 cites·8 claims
- 0762US6900076B2Methods for manufacturing semiconductor chips, methods for manufacturing semiconductor devices, semiconductor chips, semiconductor devices, connection substrates and electronic devicesSEIKO EPSON CORP·Filed 2001·Granted May 31, 2005·10 cites·26 claims
- 0859US7933128B2Electronic device, electronic module, and methods for manufacturing the sameEPSON TOYOCOM CORP·Filed 2008·Granted Apr 26, 2011·1 cites·16 claims
- 0954US9325292B2Piezoelectric device with a package including a convex partSEIKO EPSON CORP·Filed 2014·Granted Apr 26, 2016·0 cites·20 claims
- 1053US5077237AMethod of encapsulating a semiconductor element using a resin mold having upper and lower mold half resin inflow openingsSEIKO EPSON CORP·Filed 1990·Granted Dec 31, 1991·19 cites·10 claims
- 1151US8723401B2Piezoelectric device with a package including a convex partSEIKO EPSON CORP·Filed 2013·Granted May 13, 2014·0 cites·20 claims
- 1242US2010180415A1Piezoelectric resonator and manufacturing method thereforEPSON TOYOCOM CORP·Filed 2010·Application pending·0 cites
- 1340US8248813B2Electronic device, electronic module, and methods for manufacturing the sameONO ATSUSHI·Filed 2011·Granted Aug 21, 2012·0 cites·10 claims
- 1436USD580592SPiezoelectric deviceEPSON TOYOCOM CORP·Filed 2007·Granted Nov 11, 2008·3 cites·1 claims
- 1533USD580096SPiezoelectric deviceEPSON TOYOCOM CORP·Filed 2007·Granted Nov 4, 2008·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →