Inventor · disambiguated record
Akio Hayasaka
Also filed as: HAYASAKA AKIO
12 granted patents·225 citations·filing 1973–2003
92Inventor score
Files withHITACHI LTD12
Top patents by PatentIndex Score
12 records- 0193US5461501ALiquid crystal substrate having 3 metal layers with slits offset to block light from reaching the substrateHITACHI LTD·Filed 1993·Granted Oct 24, 1995·85 cites·12 claims
- 0278US6693691B2LCD and projection type display using sameHITACHI LTD·Filed 2002·Granted Feb 17, 2004·12 cites·8 claims
- 0370US6879358B2LCD and projection type display using sameHITACHI LTD·Filed 2003·Granted Apr 12, 2005·8 cites·18 claims
- 0470US6034749ALight insensitive type active matrix with P and N regions connected to a reference potentialHITACHI LTD·Filed 1995·Granted Mar 7, 2000·28 cites·13 claims
- 0570US4008107AMethod of manufacturing semiconductor devices with local oxidation of silicon surfaceHITACHI LTD·Filed 1973·Granted Feb 15, 1977·16 cites·3 claims
- 0670US3933540AMethod of manufacturing semiconductor deviceHITACHI LTD·Filed 1974·Granted Jan 20, 1976·16 cites·10 claims
- 0767US4640721AMethod of forming bipolar transistors with graft base regionsHITACHI LTD·Filed 1985·Granted Feb 3, 1987·26 cites·15 claims
- 0865US4599635ASemiconductor integrated circuit device and method of producing sameHITACHI LTD·Filed 1977·Granted Jul 8, 1986·14 cites·15 claims
- 0953US6686976B2Liquid crystal light valve and projection type display using sameHITACHI LTD·Filed 2001·Granted Feb 3, 2004·4 cites·12 claims
- 1050US6437842B1LCD and projection type display using three metalization layers and black layerHITACHI LTD·Filed 1999·Granted Aug 20, 2002·11 cites·1 claims
- 1140US4260430AMethod of manufacturing a semiconductor deviceHITACHI LTD·Filed 1979·Granted Apr 7, 1981·4 cites·5 claims
- 1230US3977920AMethod of fabricating semiconductor device using at least two sorts of insulating films different from each otherHITACHI LTD·Filed 1974·Granted Aug 31, 1976·1 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →