Inventor · disambiguated record
Akihiro Hidaka
Also filed as: HIDAKA AKIHIRO
2 granted patents·60 citations·filing 1996–1997
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0175US6199273B1Method of forming connector structure for a ball-grid arraySUMITOMO METAL IND·Filed 1996·Granted Mar 13, 2001·57 cites·14 claims
- 0226US5821455ALid with variable solder layer for sealing semiconductor package, package having the lid and method for producing the lidSUMITOMO METAL SMI ELECTRONICS·Filed 1997·Granted Oct 13, 1998·3 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →