Inventor · disambiguated record
Akira Hideno
Also filed as: HIDENO AKIRA
4 granted patents·1 pending application·180 citations·filing 1996–2007
80Inventor score
Top patents by PatentIndex Score
5 records- 0188US5981085AComposite substrate for heat-generating semiconductor device and semiconductor apparatus using the sameFURUKAWA ELECTRIC CO LTD·Filed 1997·Granted Nov 9, 1999·129 cites·7 claims
- 0276US7909087B2Heat exchangerFURUKAWA SKY ALUMINUM CORP·Filed 2007·Granted Mar 22, 2011·8 cites·16 claims
- 0369US5846348AHigh strength and toughness aluminum alloy casting by high-pressure casting method and method of manufacturing sameFURUKAWA ELECTRIC CO LTD·Filed 1996·Granted Dec 8, 1998·24 cites·3 claims
- 0463US5993576AWear resistant wrought aluminum alloy and scroll of wear-resistant wrought aluminum alloyFURUKAWA ELECTRIC CO LTD·Filed 1997·Granted Nov 30, 1999·19 cites·12 claims
- 0536US2002170706A1Heat exchangerFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →