Inventor · disambiguated record
Akira Hirao
Also filed as: HIRAO AKIRA
23 granted patents·24 pending applications·82 citations·filing 1986–2025
93Inventor score
Top patents by PatentIndex Score
47 records- 0195US10815396B2Thermally conductive pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2018·Granted Oct 27, 2020·9 cites·18 claims
- 0292US11964462B2Electrical debonding adhesive sheet, joined body, and joining and separation method for adherendNITTO DENKO CORP·Filed 2023·Granted Apr 23, 2024·1 cites·1 claims
- 0391US9683138B2Pressure-sensitive adhesive sheet and magnetic disk driveNITTO DENKO CORP·Filed 2016·Granted Jun 20, 2017·4 cites·20 claims
- 0480US12441083B2Electrical debonding adhesive sheet, joined body, and joining and separation method for adherendNITTO DENKO CORP·Filed 2024·Granted Oct 14, 2025·0 cites·2 claims
- 0580US10867980B2Semiconductor equipmentFUJI ELECTRIC CO LTD·Filed 2019·Granted Dec 15, 2020·4 cites·10 claims
- 0679US11521925B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2020·Granted Dec 6, 2022·1 cites·13 claims
- 0779US10961417B2Laminate sheet and rollNITTO DENKO CORP·Filed 2019·Granted Mar 30, 2021·1 cites·6 claims
- 0877US11623429B2Electrical debonding adhesive sheet, joined body, and joining and separation method for adherendNITTO DENKO CORP·Filed 2019·Granted Apr 11, 2023·0 cites·2 claims
- 0968US4730031APolymers of substituted 1,3-butadiene compounds having reactive silyl groups and process for their preparationNISSAN CHEMICAL IND LTD·Filed 1986·Granted Mar 8, 1988·18 cites·6 claims
- 1066US2020002581A1Electrically debondable adhesive composition, adhesive sheet, and adhered bodyNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 1165US2025145870A1Electrically debondable adhesive composition, adhesive sheet, and adhered bodyNITTO DENKO CORP·Filed 2025·Application pending·0 cites
- 1263US12394681B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·14 claims
- 1362US11434341B2Resin sheet and adhesive-layer-having resin sheetNITTO DENKO CORP·Filed 2018·Granted Sep 6, 2022·0 cites·7 claims
- 1462US8598250B2Photocurable acrylic viscoelastic material composition, acrylic viscoelastic material, acrylic viscoelastic material layer tape or sheet and proceed for producing the sameHIRAO AKIRA·Filed 2009·Granted Dec 3, 2013·1 cites·13 claims
- 1562US2025079413A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1661US10647891B2Pressure-sensitive adhesive sheet and magnetic disc deviceNITTO DENKO CORP·Filed 2019·Granted May 12, 2020·0 cites·19 claims
- 1760US2024304537A1Electronic deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1859US10329457B2Conductive pressure-sensitive adhesive tapeNITTO DENKO CORP·Filed 2017·Granted Jun 25, 2019·0 cites·7 claims
- 1958US12037522B2Electrical debonding type adhesive sheet, joined body, and debonding method for joined bodyNITTO DENKO CORP·Filed 2019·Granted Jul 16, 2024·0 cites·10 claims
- 2057US10593353B2Pressure-sensitive adhesive sheet and magnetic disc deviceNITTO DENKO CORP·Filed 2018·Granted Mar 17, 2020·0 cites·20 claims
- 2157US5429556AInternally meshing planetary gear structure and flexible meshing type gear meshing structureSUMIMOTO HEAVY IND LTD·Filed 1994·Granted Jul 4, 1995·17 cites·2 claims
- 2256US2023411313A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 2356US2010075129A1Thermally-foamable re-releasable acrylic pressure-sensitive adhesive tape or sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2454US2022112410A1Separation and bonding method for adherendNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 2553US2019284447A1Pressure-Sensitive Adhesive Sheet and Use ThereofNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 2653US2020263060A1Pressure-sensitive adhesive layer and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 2753US2013025777A1Method of reusably separating two adhered plates and apparatus used for the methodNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 2852US11605582B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted Mar 14, 2023·0 cites·17 claims
- 2952US2011003135A1Ultraviolet-curable pressure-sensitive adhesive composition, ultraviolet-curable pressure-sensitive adhesive sheet and process for producing the sameNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3052US2025372582A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 3151US2019127610A1Pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 3251US2010215947A1Heat-expandable removable acrylic pressure-sensitive adhesive tape or sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 3350US11658231B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted May 23, 2023·0 cites·10 claims
- 3450US11251163B2Semiconductor device having circuit board interposed between two conductor layersFUJI ELECTRIC CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·9 claims
- 3549US5388483AInternally meshing planetary gear structure and flexible meshing type gear meshing structureSUMIMOTO HEAVY IND LTD·Filed 1993·Granted Feb 14, 1995·11 cites·2 claims
- 3648US2018086949A1Conductive pressure-sensitive adhesive tape and method of producing conductive pressure-sensitive adhesive tapeNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 3748US2018086954A1Filler-containing pressure-sensitive adhesive tape and method of producing filler-containing pressure-sensitive adhesive tapeNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 3843US2011275727A1Cross-linked resin foam and process for producing the sameNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 3942US10090222B2Semiconductor device with heat dissipation and method of making sameFUJI ELECTRIC CO LTD·Filed 2018·Granted Oct 2, 2018·0 cites·8 claims
- 4041US2013344308A1Radiant heat conduction-suppressing sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 4141US2022032600A1Separation method and bonding method for adherendNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 4240US2020126597A1Electronic Device, Cover Seal and Method for Applying Cover SealNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 4338US6640100B1Radio communication systemKYOCERA CORP·Filed 1999·Granted Oct 28, 2003·15 cites·7 claims
- 4438US2013210301A1Composite sheetHIRAO AKIRA·Filed 2011·Application pending·0 cites
- 4535US2016249262A1Wireless communication apparatus and wireless communication methodKYOCERA CORP·Filed 2016·Application pending·0 cites
- 4633US2013216814A1W/o emulsion, foam, and functional foamHIRAO AKIRA·Filed 2011·Application pending·0 cites
- 4729US2013224467A1Foam, production method for foam, and functional foamHIRAO AKIRA·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Akira Hirao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →