Inventor · disambiguated record
Akira Horii
Also filed as: HORII AKIRA
4 granted patents·2 pending applications·5 citations·filing 2021–2025
63Inventor score
Files withKOKUSAI ELECTRIC CORP6
Top patents by PatentIndex Score
6 records- 0193US11935762B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 19, 2024·3 cites·14 claims
- 0290US11450536B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 20, 2022·2 cites·19 claims
- 0372US2025339787A1Source material collection system, substrate processing apparatus, source material collection method and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0453US12398460B2Substrate processing apparatus, furnace opening assembly, substrate processing method, method of manufacturing semiconductor device and non-transitory tangible mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 26, 2025·0 cites·14 claims
- 0549US12203169B2Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jan 21, 2025·0 cites·11 claims
- 0647US2025188617A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →