Inventor · disambiguated record
Akira Hyakusai
Also filed as: HYAKUSAI AKIRA
1 granted patent·2 pending applications·0 citations·filing 2019–2022
8Inventor score
Technology areasG06F
Top patents by PatentIndex Score
3 records- 0143US2024256739A1Molding analysis method, program, and recording mediumTOYO BOSEKI·Filed 2022·Application pending·0 cites
- 0240US11651124B2Anti-warping design method for resin molded article, recording medium, and anti-warping design device for resin molded articleTORAY ENG CO LTD·Filed 2019·Granted May 16, 2023·0 cites·20 claims
- 0337US2022277117A1Resin behavior analysis apparatus, resin behavior analysis method and resin behavior analysis programHONDA MOTOR CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →