Inventor · disambiguated record
Akira Ichiryu
Also filed as: ICHIRYU AKIRA
3 granted patents·3 pending applications·32 citations·filing 2001–2009
66Inventor score
Top patents by PatentIndex Score
6 records- 0175US6905757B2Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminateMITSUI MINING & SMELTING CO·Filed 2003·Granted Jun 14, 2005·15 cites·9 claims
- 0270US7178233B2Process for producing a collapsed filled via holeSUZUKI CO LTD·Filed 2003·Granted Feb 20, 2007·17 cites·8 claims
- 0335US6798048B22-Metal layer TAB tape and both-sided CSP•BGA tapeMITSUI MINING & SMELTING CO·Filed 2001·Granted Sep 28, 2004·0 cites·14 claims
- 0435US2011013342A1Method for producing dielectric film and method for producing capacitor layer-forming material using the method for producing dielectric filmUNIV TOKYO SCI EDUC FOUND·Filed 2009·Application pending·0 cites
- 0532US2004026122A1Printed circuit board and production method therefor, and laminated printed circuit boardFiled 2002·Application pending·0 cites
- 0630US2004099441A1Printed circuit board,its manufacturing method and csp manufacturing methodFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Akira Ichiryu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →