Inventor · disambiguated record
Akinobu Inoue
Also filed as: INOUE AKINOBU
10 granted patents·5 pending applications·163 citations·filing 1995–2022
88Inventor score
Top patents by PatentIndex Score
15 records- 0193US11444006B2Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frameSHINKO ELECTRIC IND CO·Filed 2020·Granted Sep 13, 2022·3 cites·18 claims
- 0293US7514772B2Method of manufacturing a semiconductor apparatusSHINKO ELECTRIC IND CO·Filed 2006·Granted Apr 7, 2009·41 cites·5 claims
- 0392US7261596B2Shielded semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Aug 28, 2007·43 cites·6 claims
- 0489US7772687B2Multiple electronic component containing substrateSHINKO ELECTRIC IND CO·Filed 2007·Granted Aug 10, 2010·22 cites·6 claims
- 0576US5727168AI/O card, cable connected to the I/O card, and method for saving power of I/O cardFUJITSU LTD·Filed 1995·Granted Mar 10, 1998·44 cites·8 claims
- 0672US7872359B2Electronic component contained substrateSHINKO ELECTRIC IND CO·Filed 2007·Granted Jan 18, 2011·6 cites·7 claims
- 0769US8355262B2Electronic component built-in substrate and method of manufacturing electronic component built-in substrateSHINKO ELECTRIC IND CO·Filed 2007·Granted Jan 15, 2013·4 cites·10 claims
- 0866US11955410B2Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frameSHINKO ELECTRIC IND CO·Filed 2022·Granted Apr 9, 2024·0 cites·23 claims
- 0944US9087781B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2013·Granted Jul 21, 2015·0 cites·7 claims
- 1043US2008165513A1Electronic component built-in substrate and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
- 1139US7911042B2Package having shield caseSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 22, 2011·0 cites·7 claims
- 1238US2004235287A1Method of manufacturing semiconductor package and method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2004·Application pending·0 cites
- 1337US2006125077A1Semiconductor deviceAKAIKE SADAKAZU·Filed 2005·Application pending·0 cites
- 1437US2006113679A1Semiconductor deviceTAKATSU HIROYUKI·Filed 2005·Application pending·0 cites
- 1536US2006113642A1Semiconductor deviceKAJIKI ATSUNORI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →