Inventor · disambiguated record
Akira Irifune
Also filed as: IRIFUNE Akira
2 granted patents·4 pending applications·0 citations·filing 2013–2022
21Inventor score
Top patents by PatentIndex Score
6 records- 0156US2024182614A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 0249US12447719B2Metal-clad laminate, wiring board, resin-including metal foil, and resin compositionPANASONIC IP MAN CO LTD·Filed 2020·Granted Oct 21, 2025·0 cites·18 claims
- 0348US2015344749A1Thermally-conductive, electrically-conductive adhesive compositionKANSAI UNIVERSITY·Filed 2013·Application pending·0 cites
- 0439US11254100B2Metal-clad laminate and metal foil with resinPANASONIC IP MAN CO LTD·Filed 2018·Granted Feb 22, 2022·0 cites·5 claims
- 0539US2021395452A1Metal-clad laminate, wiring board, metal foil provided with resin, and resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
- 0639US2024182657A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →