Inventor · disambiguated record
Akira Ishizu
Also filed as: ISHIZU AKIRA
5 granted patents·198 citations·filing 1987–1990
83Inventor score
Files withMITSUBISHI ELECTRIC CORP5
Top patents by PatentIndex Score
5 records- 0191US4984033AThin film semiconductor device with oxide film on insulating layerMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jan 8, 1991·99 cites·11 claims
- 0286US4822751AMethod of producing a thin film semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Apr 18, 1989·66 cites·10 claims
- 0368US4943768ATesting device for electrical circuit boardsMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jul 24, 1990·25 cites·2 claims
- 0432US5069745AProcess for preparing a combined wiring substrateMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Dec 3, 1991·4 cites·9 claims
- 0531US4887030ATesting device for electrical circuit boardsMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Dec 12, 1989·4 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →