Inventor · disambiguated record
Akira Iso
Also filed as: ISO AKIRA
14 granted patents·6 pending applications·207 citations·filing 2002–2023
91Inventor score
Top patents by PatentIndex Score
20 records- 0189USD710319SSemiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted Aug 5, 2014·49 cites·1 claims
- 0289USD704670SSemiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted May 13, 2014·47 cites·1 claims
- 0389USD704671SSemiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted May 13, 2014·51 cites·1 claims
- 0488USD710318SSemiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted Aug 5, 2014·45 cites·1 claims
- 0580US7514118B2Method of electroless plating on a glass substrate and method of manufacturing a magnetic recording medium using the method of electroless platingFUJI ELEC DEVICE TECH CO LTD·Filed 2005·Granted Apr 7, 2009·4 cites·20 claims
- 0676US8039045B2Method of manufacturing a disk substrate for a magnetic recording mediumFUJI ELECTRIC CO LTD·Filed 2005·Granted Oct 18, 2011·5 cites·12 claims
- 0772US7622205B2Disk substrate for a perpendicular magnetic recording medium and a perpendicular magnetic recording medium using the substrateFUJI ELEC DEVICE TECH CO LTD·Filed 2005·Granted Nov 24, 2009·2 cites·6 claims
- 0860US6946166B2Magnetic recording medium, a method of manufacturing the same, and a magnetic storage device using the magnetic recording mediumFUJI ELECTRIC CO LTD·Filed 2002·Granted Sep 20, 2005·4 cites·5 claims
- 0955US2024071876A1Semiconductor module, power converter, and power converter manufacturing methodFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 1051US2023098854A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 1148US2005287304A1Method of treating a substrate for electroless plating and method of increasing adhesion therebetween, and magnetic recording medium and magnetic recording device thereofFUJI ELEC DEVICE TECH CO LTD·Filed 2005·Application pending·0 cites
- 1247US9434028B2Soldering method and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Sep 6, 2016·0 cites·14 claims
- 1347US7160571B2Method of manufacturing a magnetic recording mediumFUJI ELECTRIC CO LTD·Filed 2004·Granted Jan 9, 2007·0 cites·7 claims
- 1446US10262925B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Apr 16, 2019·0 cites·11 claims
- 1545US2006210837A1Method of plating on a glass base plate, a method of manufacturing a disk substrate for a perpendicular magnetic recording medium, a disk substrate for a perpendicular magnetic recording medium, and a perpendicular magnetic recording mediumFUJI ELECTRIC DEVICE·Filed 2006·Application pending·0 cites
- 1644US2006228493A1Method of plating on a glass base plate and a method of manufacturing a perpendicular magnetic recording mediumFUJI ELEC DEVICE TECH CO LTD·Filed 2006·Application pending·0 cites
- 1743US2003170501A1Magnetic recording medium, a method of manufacturing the same, and a magnetic storage using the magnetic recording mediumFUJI ELECTRIC CO LTD·Filed 2002·Application pending·0 cites
- 1840US9905489B2Semiconductor device and electrical deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Feb 27, 2018·0 cites·15 claims
- 1940US7399386B2Magnetic recording medium, method of manufacturing the same and magnetic recording apparatusFUJI ELEC DEVICE TECH CO LTD·Filed 2002·Granted Jul 15, 2008·0 cites·3 claims
- 2039US6686025B2Magnetic recording mediumFUJI ELECTRIC CO LTD·Filed 2002·Granted Feb 3, 2004·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →