Inventor · disambiguated record
Akihiro Kawajiri
Also filed as: KAWAJIRI AKIHIRO
11 granted patents·4 pending applications·8 citations·filing 2011–2021
81Inventor score
Top patents by PatentIndex Score
15 records- 0178US10667403B2Manufacturing apparatus for performing additive manufacturing of an electrical deviceFUJI CORP·Filed 2014·Granted May 26, 2020·3 cites·7 claims
- 0276US9302484B2Ink jet printing deviceSUZUKI MASATO·Filed 2012·Granted Apr 5, 2016·2 cites·14 claims
- 0362US12245378B2Three-dimensional molding machineFUJI CORP·Filed 2019·Granted Mar 4, 2025·0 cites·9 claims
- 0462US11470724B2Manufacturing apparatus for performing additive manufacturing of an electrical deviceFUJI CORP·Filed 2019·Granted Oct 11, 2022·0 cites·12 claims
- 0560US9713241B2Reactive-species supply device and surface treatment apparatusHORI MASARU·Filed 2011·Granted Jul 18, 2017·2 cites·10 claims
- 0657US10212823B2Wiring forming method and circuit boardFUJI CORP·Filed 2014·Granted Feb 19, 2019·0 cites·8 claims
- 0753US10462909B2Wiring board manufacturing method and wiring board manufacturing deviceFUJI CORP·Filed 2014·Granted Oct 29, 2019·1 cites·4 claims
- 0851US2025340019A1Three-dimensional laminate shaping deviceFUJI CORP·Filed 2021·Application pending·0 cites
- 0947US12151438B2Image processing device, image processing method, and computer readable medium that process an image in which a wiring pattern is drawn and outputs the image as raster dataFUJI CORP·Filed 2019·Granted Nov 26, 2024·0 cites·7 claims
- 1046US10933589B2Data conversion device and lamination shaping systemFUJI CORP·Filed 2016·Granted Mar 2, 2021·0 cites·9 claims
- 1144US2025010629A13d printerFUJI CORP·Filed 2021·Application pending·0 cites
- 1241US11439025B2Method for forming circuitFUJI CORP·Filed 2016·Granted Sep 6, 2022·0 cites·4 claims
- 1341US2018022033A1Data conversion device and additive manufacturing systemFUJI MACHINE MFG·Filed 2015·Application pending·0 cites
- 1437US11006529B2Circuit forming methodFUJI CORP·Filed 2016·Granted May 11, 2021·0 cites·5 claims
- 1537US2015207050A1Semiconductor package and manufacturing method thereofTSUKADA KENJI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →