Inventor · disambiguated record
Akiko Koyama
Also filed as: KOYAMA AKIKO
1 granted patent·5 pending applications·1 citations·filing 2013–2015
15Inventor score
Files withFUJIFILM CORP6
Top patents by PatentIndex Score
6 records- 0162US10435794B2Etching method, etching solution used in same, and production method for semiconductor substrate productFUJIFILM CORP·Filed 2015·Granted Oct 8, 2019·1 cites·26 claims
- 0241US2016118264A1Etching method, etching solution used in same, etching solution kit, and method for manufacturing semiconductor substrate productFUJIFILM CORP·Filed 2014·Application pending·0 cites
- 0337US2014001145A1Method of forming a capacitor structure, and a silicon etching liquid used in this methodFUJIFILM CORP·Filed 2013·Application pending·0 cites
- 0432US2016056054A1Etching method, etching liquid and etching liquid kit to be used in said method, and semiconductor substrate product manufacturing methodFUJIFILM CORP·Filed 2015·Application pending·0 cites
- 0531US2016053386A1Etching solution and etching solution kit, etching method using same, and production method for semiconductor substrate productFUJIFILM CORP·Filed 2015·Application pending·0 cites
- 0630US2016047053A1Etching solution, etching solution kit, etching method using same, and method for manufacturing semiconductor substrate productFUJIFILM CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →