Inventor · disambiguated record
Akihito Kurosaka
Also filed as: KAIZU MASAHIRO · KUROSAKA AKIHITO
8 granted patents·335 citations·filing 1991–2004
90Inventor score
Top patents by PatentIndex Score
8 records- 0191US6835595B1Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor packageFUJIKURA LTD·Filed 2000·Granted Dec 28, 2004·60 cites·8 claims
- 0290US7023088B2Semiconductor package, semiconductor device and electronic deviceTEXAS INSTRUMENTS JAPAN·Filed 2003·Granted Apr 4, 2006·53 cites·9 claims
- 0387US7157363B2Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portionTEXAS INSTRUMENTS JAPAN·Filed 2004·Granted Jan 2, 2007·39 cites·11 claims
- 0486US6387734B1Semiconductor package, semiconductor device, electronic device and production method for semiconductor packageFUJIKURA LTD·Filed 1999·Granted May 14, 2002·94 cites·15 claims
- 0580US5106701ACopper alloy wire, and insulated electric wires and multiple core parallel bonded wires made of the sameFUJIKURA LTD·Filed 1991·Granted Apr 21, 1992·57 cites·8 claims
- 0678US5336341AInfrared radiation element and process of producing the sameFUJIKURA LTD·Filed 1991·Granted Aug 9, 1994·29 cites·17 claims
- 0730US6363791B1Pressure sensorFUJITSU LTD·Filed 1999·Granted Apr 2, 2002·2 cites·25 claims
- 0824US5366583AProcess for preparing barium titanate single crystalsFUJIKURA LTD·Filed 1992·Granted Nov 22, 1994·1 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →