Inventor · disambiguated record
Akihiro Masuda
Also filed as: MASUDA AKIHIRO
39 granted patents·9 pending applications·127 citations·filing 1992–2024
96Inventor score
Top patents by PatentIndex Score
48 records- 0195US11222752B2Ceramic electronic deviceTDK CORP·Filed 2020·Granted Jan 11, 2022·3 cites·12 claims
- 0290US11158460B2Ceramic electronic component with lead terminals having a coating layerTDK CORP·Filed 2020·Granted Oct 26, 2021·2 cites·10 claims
- 0385US11615920B2Ceramic electronic deviceTDK CORP·Filed 2020·Granted Mar 28, 2023·1 cites·17 claims
- 0482US9199778B2Oxygen absorbing resin composition, oxygen absorbing multilayered body, and oxygen absorbing hollow containerMITSUBISHI GAS CHEMICAL CO·Filed 2012·Granted Dec 1, 2015·4 cites·32 claims
- 0579US9067800B2Method for manufacturing tin(II) oxide powder for replenishing tin component of tin-alloy plating solution, and tin (II) oxide powder manufactured using said methodKATASE TAKUMA·Filed 2012·Granted Jun 30, 2015·4 cites·3 claims
- 0678US5315431AOptical isolatorFUJI ELECTROCHEMICAL CO LTD·Filed 1992·Granted May 24, 1994·54 cites·5 claims
- 0775US9151427B2Resin pipe jointIMANISHI RYO·Filed 2009·Granted Oct 6, 2015·10 cites·3 claims
- 0874US8568114B2Reciprocating pumpMASUDA AKIHIRO·Filed 2008·Granted Oct 29, 2013·6 cites·7 claims
- 0973US9260596B2Oxygen-absorbing resin compositionKASHIBA TAKASHI·Filed 2010·Granted Feb 16, 2016·6 cites·9 claims
- 1071US9644774B2Welding joint and welding method for same, welding device, welding joint, resin pipe welding device and welding methodIMANISHI RYO·Filed 2011·Granted May 9, 2017·3 cites·4 claims
- 1170US12062495B2Electronic deviceTDK CORP·Filed 2023·Granted Aug 13, 2024·0 cites·12 claims
- 1269US12432860B2Electronic deviceTDK CORP·Filed 2023·Granted Sep 30, 2025·0 cites·14 claims
- 1365US11961676B2Electronic deviceTDK CORP·Filed 2022·Granted Apr 16, 2024·0 cites·10 claims
- 1465US11798743B2Electronic deviceTDK CORP·Filed 2021·Granted Oct 24, 2023·0 cites·24 claims
- 1565US9108861B2Tin(II) oxide powder for replenishing tin component of tin-alloy plating solution and method for manufacturing said powderKATASE TAKUMA·Filed 2012·Granted Aug 18, 2015·1 cites·7 claims
- 1665US2024320579A1Production planning device, production planning method, and recording mediumTDK CORP·Filed 2024·Application pending·0 cites
- 1764US12340943B2Electronic deviceTDK CORP·Filed 2023·Granted Jun 24, 2025·0 cites·8 claims
- 1863US12437927B2Electronic device with a ceramic element and surface-mount terminalsTDK CORP·Filed 2023·Granted Oct 7, 2025·0 cites·8 claims
- 1961US11810723B2Ceramic electronic componentTDK CORP·Filed 2021·Granted Nov 7, 2023·0 cites·10 claims
- 2061US2025157735A1Electronic componentTDK CORP·Filed 2024·Application pending·0 cites
- 2160US12476048B2Electronic component including accommodation part having openingTDK CORP·Filed 2023·Granted Nov 18, 2025·0 cites·10 claims
- 2260US11594379B2Electronic deviceTDK CORP·Filed 2021·Granted Feb 28, 2023·0 cites·22 claims
- 2360US9222608B2Resinous tube jointTESHIMA KAZUKIYO·Filed 2009·Granted Dec 29, 2015·3 cites·12 claims
- 2460US9109728B2Resinous pipe jointTESHIMA KAZUKIYO·Filed 2009·Granted Aug 18, 2015·3 cites·20 claims
- 2559US12412702B2Electronic device having ceramic element and metal terminalsTDK CORP·Filed 2023·Granted Sep 9, 2025·0 cites·14 claims
- 2658US12278055B2Electronic componentTDK CORP·Filed 2023·Granted Apr 15, 2025·0 cites·12 claims
- 2758US2025210259A1CapacitorTDK CORP·Filed 2024·Application pending·0 cites
- 2856US11646163B2Electronic deviceTDK CORP·Filed 2021·Granted May 9, 2023·0 cites·11 claims
- 2956US11140781B2Electronic deviceTDK CORP·Filed 2019·Granted Oct 5, 2021·0 cites·10 claims
- 3054US11335508B2Electronic deviceTDK CORP·Filed 2019·Granted May 17, 2022·0 cites·25 claims
- 3153US12417880B2Electronic device having first and second metal terminalsTDK CORP·Filed 2022·Granted Sep 16, 2025·0 cites·10 claims
- 3252US11495405B2Electronic deviceTDK CORP·Filed 2020·Granted Nov 8, 2022·0 cites·23 claims
- 3351US11367572B2Conductive terminal and electronic deviceTDK CORP·Filed 2020·Granted Jun 21, 2022·0 cites·14 claims
- 3450US12198648B2Boost dc-dc converter and liquid-crystal display apparatusSHARP DISPLAY TECHNOLOGY CORP·Filed 2023·Granted Jan 14, 2025·0 cites·5 claims
- 3550US11984260B2Electronic device including chip component and caseTDK CORP·Filed 2020·Granted May 14, 2024·0 cites·5 claims
- 3650US9334377B2Process for producing resin composition containing active particlesMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted May 10, 2016·0 cites·13 claims
- 3749US9506163B2Method of electroplating with Sn-alloy and apparatus of electroplating with Sn-alloyMITSUBISHI MATERIALS CORP·Filed 2013·Granted Nov 29, 2016·0 cites·3 claims
- 3846US5651873AElectroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surfaceMITSUBISHI MATERIALS CORP·Filed 1995·Granted Jul 29, 1997·14 cites·15 claims
- 3946US2007171528A1Polarized wave coupling optical isolatorABE SHOHEI·Filed 2007·Application pending·0 cites
- 4042US10081480B2ContainerMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted Sep 25, 2018·0 cites·12 claims
- 4141US2006077546A1Polarized wave coupling optical isolatorABE SHOHEI·Filed 2005·Application pending·0 cites
- 4240US2019099738A1Oxygen absorber composition, oxygen-absorbing multilayer body, oxygen-absorbing packet, and method for storing articleMITSUBISHI GAS CHEMICAL CO·Filed 2017·Application pending·0 cites
- 4336US2003030905A1Polarized wave coupling optical isolatorFiled 2002·Application pending·0 cites
- 4435US6155722ATwin-core ferrule structure for an optical connectorTOTOKU ELECTRIC·Filed 1999·Granted Dec 5, 2000·6 cites·6 claims
- 4533US2004109693A1Variable optical equalizer and optical multiplex transmission systemFiled 2003·Application pending·0 cites
- 4632US6229528B1Tablet stacked on LCD read after display line pulse signal in order to avoid impulse noise superposed on the tablet coordinate signal to improve measuring accuracySHARP KK·Filed 1998·Granted May 8, 2001·7 cites·18 claims
- 4731US8822326B2Method for manufacturing Sn alloy bumpHATTA TAKESHI·Filed 2012·Granted Sep 2, 2014·0 cites·4 claims
- 4830US2006113006A1Tin-containing plating bathMASUDA AKIHIRO·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Akihiro Masuda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →