Inventor · disambiguated record
Akiko Matsui
Also filed as: MATSUI AKIKO
24 granted patents·7 pending applications·29 citations·filing 2006–2020
92Inventor score
Top patents by PatentIndex Score
31 records- 0184US9188743B2Optical coupling structure and optical transmission apparatusFUJITSU LTD·Filed 2013·Granted Nov 17, 2015·7 cites·8 claims
- 0283US9992878B2Circuit board and method of manufacturing the sameFUJITSU LTD·Filed 2015·Granted Jun 5, 2018·4 cites·9 claims
- 0378US10877216B2Optical waveguide substrate, method of manufacturing optical waveguide substrate, and method of repairing optical waveguide substrateFUJITSU LTD·Filed 2019·Granted Dec 29, 2020·2 cites·7 claims
- 0474US10353158B2Light emitting element bonded board and method of manufacturing light emitting element bonded boardFUJITSU LTD·Filed 2017·Granted Jul 16, 2019·2 cites·5 claims
- 0574US9148958B2Circuit board and electronic deviceFUJITSU LTD·Filed 2014·Granted Sep 29, 2015·2 cites·2 claims
- 0674US8648260B2Wiring substrateOOI TAKAHIRO·Filed 2011·Granted Feb 11, 2014·4 cites·4 claims
- 0768US10212805B2Printed circuit board and electric deviceFUJITSU LTD·Filed 2017·Granted Feb 19, 2019·1 cites·9 claims
- 0867US9715062B2Optical axis adjustment method for optical interconnection, and optical interconnection substrateFUJITSU LTD·Filed 2015·Granted Jul 25, 2017·1 cites·10 claims
- 0967US8958211B2Circuit board and electronic deviceHIROSHIMA YOSHIYUKI·Filed 2011·Granted Feb 17, 2015·2 cites·9 claims
- 1066US11158964B2Electronic component and substrateFUJITSU LTD·Filed 2020·Granted Oct 26, 2021·0 cites·7 claims
- 1165US9763331B2Printed circuit board, electronic device, and manufacturing methodFUJITSU LTD·Filed 2016·Granted Sep 12, 2017·1 cites·9 claims
- 1262US10714849B2Electronic component and substrateFUJITSU LTD·Filed 2019·Granted Jul 14, 2020·1 cites·10 claims
- 1358US9049794B2Wiring substrate and method for manufacturing the wiring substrateMORITA YOSHIHIRO·Filed 2011·Granted Jun 2, 2015·1 cites·6 claims
- 1456US10151878B2Optical interconnection substrate including optical transmitter with light source and mark or optical receiver with light receiving unit and markFUJITSU LTD·Filed 2017·Granted Dec 11, 2018·0 cites·9 claims
- 1556US9572293B2Placement apparatus and a suction nozzle for an optical componentFUJITSU LTD·Filed 2014·Granted Feb 14, 2017·0 cites·14 claims
- 1652US9470856B2Method of manufacturing photoelectric composite substrateFUJITSU LTD·Filed 2013·Granted Oct 18, 2016·0 cites·5 claims
- 1751US10929585B2Recording medium recording via lifetime calculation program, via lifetime calculation method, and information processing deviceFUJITSU LTD·Filed 2019·Granted Feb 23, 2021·0 cites·20 claims
- 1851US10492291B2Wiring board manufacturing methodFUJITSU LTD·Filed 2017·Granted Nov 26, 2019·0 cites·10 claims
- 1950US8777091B2Light emitting member mounting method and apparatusFUJITSU LTD·Filed 2013·Granted Jul 15, 2014·0 cites·3 claims
- 2050US8631568B2Printed wiring board manufacturing methodYAMADA TETSURO·Filed 2011·Granted Jan 21, 2014·1 cites·8 claims
- 2149US10164312B2Wiring board, electronic apparatus, and manufacturing method of wiring boardFUJITSU LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 2249US2009166080A1Multilayer wiring board and method of manufacturing the sameFUJITSU LTD·Filed 2008·Application pending·0 cites
- 2348US11435385B2Specific conductivity measurement method, recording medium recording specific conductivity calculation program, and specific conductivity measurement systemFUJITSU LTD·Filed 2020·Granted Sep 6, 2022·0 cites·5 claims
- 2448US2008217051A1Wiring board and method of manufacturing wiring boardFUJITSU LTD·Filed 2008·Application pending·0 cites
- 2547US10783309B2Method for outputting impact degree and information processing deviceFUJITSU LTD·Filed 2019·Granted Sep 22, 2020·0 cites·15 claims
- 2646US2007272436A1Printed circuit board unitFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2745US2012234587A1Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring boardNAKAMURA NAOKI·Filed 2012·Application pending·0 cites
- 2843US8513537B2Printed board and method of manufacturing printed boardOOI TAKAHIRO·Filed 2010·Granted Aug 20, 2013·0 cites·6 claims
- 2942US2008217052A1Wiring board and method of manufacturing wiring boardFUJITSU LTD·Filed 2008·Application pending·0 cites
- 3038US2011241233A1Method for manufacturing optical waveguideFUJITSU LTD·Filed 2011·Application pending·0 cites
- 3136US2012106105A1Wiring board having a plurality of viasSUGANE MITSUHIKO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →